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TDK MLG1005S12NJT000
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S12NJT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S12NJT000
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Inductor
- 12nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0259459644
- Current
- 400mA
- Frequency
- 2.5GHz
- Resistor(DCR)
- 250mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S12NJT000 — TDK 0402 12nH ±5% 贴片电感产品概述
一、产品简介
MLG1005S12NJT000 是 TDK 推出的超小型表面贴装电感，封装尺寸为 0402（1005 公制），标称电感值 12 nH，公差 ±5%。凭借极小体积与稳定的频率特性，适合空间受限的高频电路与射频前端应用。
二、主要性能参数
- 电感值：12 nH，±5%
- 额定直流电流：400 mA（最大持续工作电流，请参照使用环境进行热与磁退化评估）
- 直流电阻（DCR）：约 250 mΩ
- 品质因数（Q）：8 @ 100 MHz
- 自谐振频率（SRF）：约 2.5 GHz
- 封装：0402（1005）表面贴装
三、特性与工程意义
- 小体积、低剖面，便于高密度 PCB 布局。
- 在 100 MHz 附近具有适度感抗与 Q 值，适合作为射频匹配元件、窄带滤波或阻抗调节用途。
- DCR 相对较高，意味着在直流偏置和低频应用时有一定功耗，应关注发热与电流能力；高频下等效交流损耗会进一步增加（Q 值反映的等效串联电阻高于 DCR）。
- SRF 达到约 2.5 GHz，可覆盖许多移动通信与无线应用频段，但在接近或超过 SRF 的工作频率时，元件行为将偏离理想电感。
四、典型应用
- 射频匹配网络（输入/输出阻抗匹配、滤波器）
- 移动设备射频前端与天线匹配子网络
- 高频滤波与去耦（与电容形成 LC 拒频或带通）
- EMI 抑制与共模/差模小信号处理电路（注意功率与频带限制）
五、封装与安装建议
- 建议按 TDK 或行业推荐的 0402 焊盘尺寸与过孔布局进行 PCB 设计，保持良好焊接端面宽度以降低接触电阻。
- 推荐采用无铅回流焊工艺，遵循元件厂家温度曲线，避免过高峰值温度与多次重复加热。
- 对于长期高电流或高温环境，建议在样机阶段进行热仿真与实测，必要时对电流进行适度降额使用以保证可靠性与性能稳定。
六、可靠性与选型要点
- 关注工作环境温度、潮湿及振动条件，0402 尺寸对机械应力较敏感，建议在抛锡、清洗与贴装时采取防护措施。
- 在射频设计中，考虑元件的频率响应（SRF）与寄生电容、寄生电阻对电路性能的影响；如需更高 Q 或更低 DCR，可考虑更大封装或不同材料的产品线。
- 选型时结合实际频段、允许功耗与 PCB 空间综合评估。如需替代或批量采购，建议与 TDK 官方资料对照核验完整数据表与可靠性报告。
总体而言，MLG1005S12NJT000 以其极小封装与可观的射频特性，适合对体积与频带有严格要求的高频应用；在使用时应关注直流功耗与高频损耗带来的性能与热管理影响。
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