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TDK C1005NP01H101JT000F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK C1005NP01H101JT000F
- Type
- 0402
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- C1005NP01H101JT000F
- Electronic Component
- 1
- Electronic Component
- 100pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0258757470
- Electronic Component
- NP0
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1005NP01H101JT000F 产品概述
一、产品简介
TDK C1005NP01H101JT000F 是一款贴片多层陶瓷电容（MLCC），标称电容值为 100 pF，精度 ±5%（J），额定电压 50 V，介质为 NP0（亦称 C0G）。器件为 0402（C1005）超小封装，适用于高密度表面贴装电路。该系列以温漂小、稳定性高著称，适合对频率特性和温度稳定性要求较高的场合。
二、主要特性
- 电容：100 pF，公差 ±5%
- 额定电压：50 V DC
- 介质：NP0/C0G（温度系数近似为 0 ppm/°C）
- 封装：0402（1.0 mm × 0.5 mm 级别）
- 极低的温度漂移与老化，损耗小、Q 值高
- 适配标准 SMT 卷带包装，便于自动贴装
三、电气与温度特性
NP0（C0G）材料在宽温区间（通常 -55°C 至 +125°C）内电容几乎不变，适合需要高精度的时钟、滤波和谐振电路。NP0 具有极低的介质损耗和非常小的非线性电压系数，因此在射频、滤波、振荡与模拟前端等场合能提供稳定的性能。
四、机械与封装信息
0402 封装尺寸利于高密度布板设计，尺寸小可显著降低占板空间。器件为贴片卷带包装，兼容常见贴片机与回流焊流程。由于陶瓷类电容易受机械应力影响，贴装与回流过程中应注意焊盘设计与应力释放，避免焊接后在器件上产生弯曲或应力集中导致裂纹。
五、典型应用
- 高频滤波与阻抗匹配（RF 前端）
- 时钟、振荡器旁路与定时电路
- 精密模拟电路与采样保持电容
- 移动终端、消费类电子、通信设备与测量仪器
六、装配与储存建议
- 推荐采用无铅回流工艺，遵循器件厂商建议的温度曲线（注意回流峰值温度与循环次数限制）。
- 流程中避免对器件施加过大弯曲或机械冲击，贴片过程中保持焊膏量与焊盘尺寸匹配。
- 长期高湿环境下建议按供应商说明进行防潮处理或烘烤，以保证焊接可靠性与性能稳定。
七、采购与替代建议
TDK C1005NP01H101JT000F 适用于需要体积小、温漂低和高 Q 的设计场景。选型时可根据精度、耐压和封装要求在同类 NP0/C0G 产品中比对 ESR、DF 和封装兼容性。若需更大电压或更高容值，可考虑相邻尺寸或不同额定电压的 NP0 系列型号；如对成本更敏感且温漂要求放宽，可考虑 X7R 等介质替代，但需注意温度与电压依赖性差异。
如需具体数据表（包括容差温漂曲线、损耗因数、最大电流、回流曲线与包装规格），建议向 TDK 获取最新器件数据手册以便在设计与生产中参考。
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