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TDK CGA2B2X7R1E223KT0Y0F
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK CGA2B2X7R1E223KT0Y0F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA2B2X7R1E223KT0Y0F
- Electronic Component
- 1
- Electronic Component
- 22nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0257285461
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK CGA2B2X7R1E223KT0Y0F 产品概述
一、产品概况
TDK型号CGA2B2X7R1E223KT0Y0F为贴片多层陶瓷电容（MLCC），额定电容22nF（223）、容差±10%、额定电压25V，介质材料为X7R，封装0402（公制约1.0×0.5 mm）。该系列以体积小、可靠性高、适应广泛工作温度和成本优势著称，适合现代便携及高密度PCB应用。
二、电气与温度特性
X7R介质保证在–55℃至+125℃范围内电容变化在±15%以内，适用于旁路、去耦和滤波等通用用途。需注意X7R为高介电常数材料，存在DC偏压下电容下降现象，随着工作电压接近额定值，实际有效电容会有所降低，设计时应预留裕量。频率特性稳定，适合从低频到几十MHz的去耦需求。
三、封装与机械特性
0402微小封装利于高密度布板及微型化终端产品，但对贴装工艺及焊接可靠性要求较高。短走线、小焊盘、最小回流热应力可降低机械应力导致的裂纹风险。厂家提供卷盘（Reel）包装，适合自动贴片线。
四、典型应用场景
- 电源去耦与旁路：移动设备、通信模块、传感器前端。
- 模拟滤波：输入/输出耦合、RC滤波网络（需注意电容偏差与温漂）。
- 高频旁路：配合较低ESR电感用于EMI抑制与瞬态响应改善。
- 一般目的耦合与频率补偿电路。
五、设计与使用建议
- 尽量靠近供电引脚布置，缩短回路长度以提高去耦效果。
- 在对容量精度和稳定性要求高的场合，可并联多只同型号或与NP0/C0G电容混用以降低温漂与偏压影响。
- 按照TDK推荐的回流焊曲线和湿敏等级（MSL）处理，避免机械应力集中，必要时采用加固设计。
- 评估工作电压下的有效电容，预留裕度以保证功能稳定。
六、总结
CGA2B2X7R1E223KT0Y0F以其小型化封装和X7R良好温度特性，适合大多数便携与工业电子中的去耦与滤波任务。设计时应重视偏压效应与封装尺寸带来的装配要求，以确保长期可靠性与电性能达标。若需更详细的电气特性曲线与回流焊工艺参数，建议参考TDK产品说明书或联系供应商获取官方资料。
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