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TDK MLG1005S1N8BT000
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S1N8BT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S1N8BT000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 1.8nH
- Electronic Component
- 1
- Factor
- 7@100MHz
- Electronic Component
- BM0255087586
- Current
- 900mA
- Frequency
- 8GHz
- Resistor(DCR)
- 60mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S1N8BT000 产品概述
一、产品简介
TDK MLG1005S1N8BT000 是一款0402（1005公制）封装的叠层贴片电感，标称电感值为 1.8 nH，直流电阻（DCR）约 60 mΩ，额定电流 900 mA，品质因数 Q=7（@100 MHz），自谐振频率（SRF）约 8 GHz。该器件体积小、寄生参数低，适合高频射频匹配与去耦应用，在空间受限且对高频性能有要求的电路中表现良好。
二、主要参数与电气特性
- 电感值：1.8 nH（标称）
- 额定电流：900 mA（连续工作电流，超过会引起温升与电感值漂移）
- 直流电阻：60 mΩ（典型）
- 品质因数：7 @ 100 MHz（表征损耗，随着频率变化）
- 自谐振频率：约 8 GHz（高于此频率电感行为开始被电容性寄生主导）
- 封装：0402（1.0 × 0.5 mm 典型尺寸，详细尺寸请参见TDK原厂图纸）
- 类型：叠层陶瓷电感（MLG，多层结构）
三、应用场景
- 无线通讯前端匹配网络（手机、Wi‑Fi、蓝牙等中高频段）
- 射频滤波与阻抗匹配、谐振回路元件
- 高频去耦与噪声抑制（要求低DCR和高SRF的场合）
- 高频接口的串联电感与小型谐振元件
- 空间受限的消费电子与工业电子设备
四、设计与使用要点
- SRF ≈ 8 GHz，适合至数 GHz 的射频应用；在接近或高于 SRF 时应避免将其作为电感元件使用。
- DCR 较低，可降低插入损耗，但实际电路中的总体损耗还与匹配网络和 PCB 布局有关。
- Q 值随频率变化，100 MHz 时为 7，设计时应根据目标频率查看厂家频率响应曲线以评估损耗。
- 额定电流 900 mA 用于判断热升与电感饱和风险，若存在脉冲或瞬态电流请留有裕量。
五、封装与工艺建议
- 使用标准0402贴片工艺，推荐参考 TDK 的推荐焊盘尺寸与回流曲线，严格控制回流温度与湿度等级（MSL）。
- 轻拿轻放，避免过大机械应力；贴装时避免过多的焊膏堆积和焊接拉力导致器件裂纹。
- 若设计用于高频射频通道，注意缩短走线长度、避免不必要的过孔与串扰，以保持器件标称性能。
六、对比与选型建议
MLG1005S1N8BT000 属于叠层陶瓷电感系列，较适合需要体积小、SRF 高且 DCR 低的中高频场合。与铁氧体磁珠相比，其在高频下表现为明确电感量，适用于谐振与匹配；与线绕电感相比，体积更小且自谐振频率更高。选型时应综合考虑工作频率、允许损耗、直流电流以及板级布局限制。
如需进一步的频率特性曲线、温度漂移、机械尺寸图或推荐焊盘，请参阅 TDK 官方数据手册或联系供应商获取原厂技术支持。
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