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TDK MLZ2012M2R2HTD25
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLZ2012M2R2HTD25
- Type
- TDK
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLZ2012M2R2HTD25
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.042g
- Inductor
- 2.2uH
- Electronic Component
- 1
- Electronic Component
- BM0257326056
- Electronic Component
- AEC-Q200
- Resistor(DCR)
- 160mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
- and Current(Isat)
- 400mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLZ2012M2R2HTD25 产品概述
一、产品简介
MLZ2012M2R2HTD25 为 TDK 出品的屏蔽多层贴片电感，标称电感值 2.2µH，公差 ±20%。器件采用 0805（2012 公制）封装，小尺寸、高可靠性，适合对体积与性能均有要求的电源与滤波应用。产品满足 AEC‑Q200 车规等级，适用于汽车电子及工业级环境。
二、主要参数
- 电感值：2.2µH（±20%）
- 饱和电流 Isat：400mA（电感下降到额定值一定比例时计）
- 额定持续电流（Irms，可参考）：约 600mA（描述中给出）
- 直流电阻 DCR：约 160mΩ
- 封装：0805（2012 公制，约 2.0 × 1.25 mm）
- 屏蔽结构：具有良好磁通约束，降低辐射干扰
- 车规等级：AEC‑Q200
三、结构与封装优势
该系列为多层陶瓷绕线结构并加屏蔽设计，体积小、寄生电容与辐射均受控，适合贴片工艺高速回流焊装配。0805 尺寸兼顾占板面积与功率处理能力，便于在空间受限的点对点电源滤波或 DC‑DC 输出端使用。
四、性能与熱耗考量
DCR≈160mΩ，在额定持续电流 600mA 条件下，铜损约为 P＝I²·R ≈0.6²×0.16≈0.058W；若达到饱和电流 400mA 时损耗约 0.026W。设计时应考虑电感随电流上升的电感下降（趋向饱和）及由此对滤波或储能性能的影响。
五、典型应用场景
- 汽车电子点对点电源滤波与去耦（符合 AEC‑Q200）
- 移动通信/车载信息娱乐的电源管理模块
- 小功率 DC‑DC 升降压转换器的输出滤波器
- EMI 抑制、信号完整性改善的输入滤波网络
六、选型与使用建议
- 若电路常态电流接近或超过 Isat，应优先考虑更高饱和电流规格，以避免电感值显著下降。
- 评价热耗时按实际工作电流计算 I²·DCR，并结合 PCB 散热与环境温度评估温升。
- 推荐参照 TDK 官方 Datasheet 的回流焊温度曲线和推荐焊盘尺寸进行布板与焊接，避免反复超温导致机械或电气性能劣化。
- 在高频滤波设计中，注意器件自谐振频率（SRF）与工作频带匹配，必要时做实际频率响应测量。
七、总结
MLZ2012M2R2HTD25 以其 2.2µH 的电感值、屏蔽多层结构和 AEC‑Q200 车规认证，在要求体积小、可靠性高的电源滤波与点负载应用中具备竞争力。选型时应综合考虑饱和电流、DCR 对电路效率与温升的影响，按照 TDK 的封装与焊接指南进行设计与装配，可在汽车及工业级场景中实现稳定可靠的滤波性能。若需精确频率特性或热特性数据，请参考 TDK 官方资料或向供应商索取完整 Datasheet。
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