WMSIC Electronic Components

TDK C2012X5R1C226KT000E

ModelC2012X5R1C226KT000E
Package0805
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK C2012X5R1C226KT000E
Type
TDK
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
C2012X5R1C226KT000E
Electronic Component
1
Electronic Component
22uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.042g
Electronic Component
1
Electronic Component
BM0223245921
Electronic Component
X5R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

C2012X5R1C226KT000E 产品概述

一、产品简介

C2012X5R1C226KT000E是由知名电子元器件品牌TDK公司生产的一款高性能多层陶瓷电容器(MLCC),具有16V的额定电压,容量为22μF,容差为±10%。产品采用0805标准封装,非常适合现代电子设备的小型化需求。其X5R介质特性使得该电容在不同温度和电压变化下能够保持良好的电气性能,广泛应用于消费电子、工业设备、汽车电子等多个领域。

二、关键参数

  • 类型: 多层陶瓷电容器(MLCC)
  • 额定电压: 16V
  • 电容量: 22μF
  • 容差: ±10%
  • 介质类: X5R
  • 封装尺寸: 0805 (2.0mm x 1.25mm)
  • 品牌: TDK

三、介质特性

X5R陶瓷电容器以其出色的电气特性和温度适应性而著称。X5R的技术特性允许其在-55°C到+85°C的温度范围内稳定工作,其电容量的变化不超过±15%,使其在不同的工作环境中保持相对稳定的 capacitance。在实际应用中,X5R电容器特别适合需要电源去耦和滤波等场合,提供良好的高频特性。

四、主要应用

C2012X5R1C226KT000E电容器因其小型化、低ESR(等效串联电阻)和高可靠性,适用于许多场合。以下是一些典型应用:

  1. 消费电子产品: 包括智能手机、平板电脑、笔记本电脑等,电容用作电源去耦和信号耦合。
  2. 工业设备: 在工业控制模块和传感器中使用,以确保稳定的电源供应和系统可靠性。
  3. 汽车电子: 在汽车信息娱乐系统和传感器应用中,提供抗高温和电磁干扰的电力支持。
  4. 通信设备: 在各类无线通信模块和基站中承担良好的滤波作用,确保信号传输的稳定性。

五、性能优势

C2012X5R1C226KT000E电容器的设计和制造充分考虑了现代电子设备对空间和能效的要求,其优点包括:

  • 小型化: 0805封装尺寸适合紧凑型电路设计,节省空间。
  • 可靠性高: TDK作为知名品牌,具有严格的质量控制流程,提供高可靠性的产品。
  • 低ESR: 低等效串联电阻使其在高频应用中表现出色,减少信号损耗。
  • 温度稳定性: X5R介质确保在不同环境条件下的稳定工作。

六、结论

C2012X5R1C226KT000E多层陶瓷电容器凭借其优越的电气性能和可靠性,成为各类电子产品中不可或缺的部分。无论是在消费电子、工业控制还是汽车电子领域,该电容器都能满足高标准的应用需求,提供持久和稳定的电气性能。凭借TDK的品牌优势和技术实力,C2012X5R1C226KT000E无疑是您在电路设计过程中的理想合作伙伴。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.