Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C2012X5R1C226KT000E是由知名电子元器件品牌TDK公司生产的一款高性能多层陶瓷电容器(MLCC),具有16V的额定电压,容量为22μF,容差为±10%。产品采用0805标准封装,非常适合现代电子设备的小型化需求。其X5R介质特性使得该电容在不同温度和电压变化下能够保持良好的电气性能,广泛应用于消费电子、工业设备、汽车电子等多个领域。
X5R陶瓷电容器以其出色的电气特性和温度适应性而著称。X5R的技术特性允许其在-55°C到+85°C的温度范围内稳定工作,其电容量的变化不超过±15%,使其在不同的工作环境中保持相对稳定的 capacitance。在实际应用中,X5R电容器特别适合需要电源去耦和滤波等场合,提供良好的高频特性。
C2012X5R1C226KT000E电容器因其小型化、低ESR(等效串联电阻)和高可靠性,适用于许多场合。以下是一些典型应用:
C2012X5R1C226KT000E电容器的设计和制造充分考虑了现代电子设备对空间和能效的要求,其优点包括:
C2012X5R1C226KT000E多层陶瓷电容器凭借其优越的电气性能和可靠性,成为各类电子产品中不可或缺的部分。无论是在消费电子、工业控制还是汽车电子领域,该电容器都能满足高标准的应用需求,提供持久和稳定的电气性能。凭借TDK的品牌优势和技术实力,C2012X5R1C226KT000E无疑是您在电路设计过程中的理想合作伙伴。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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