Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK C2012X5R1E226MT000E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK C2012X5R1E226MT000E
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 2000
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- C2012X5R1E226MT000E
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0257238886
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C2012X5R1E226MT000E 产品概述
一、产品概述
C2012X5R1E226MT000E 为 TDK 推出的贴片多层陶瓷电容（MLCC），标称容值 22 µF，额定电压 25 V，容差 ±20%，介电材料为 X5R，封装为 0805（公制 2012）。该器件面向需要中等容量与中等温度稳定性的去耦、滤波与储能场合，兼顾体积与容量密度。
二、主要规格
- 容值：22 µF（226 表示 22 + 4 个 0？此处按标称 22 µF）
- 容差：±20%（M）
- 额定电压：25 V
- 介质：X5R（工作温度范围 -55 ℃ ~ +85 ℃，温度下容值变化典型 ≤ ±15%）
- 封装：0805（约 2.0 mm × 1.25 mm，厚度随型号略有差异）
- 制造商：TDK
三、关键特性与注意事项
- 温度特性：X5R 在 −55℃ 至 +85℃ 范围内保持较好的容值稳定性，但仍有最多 ±15% 的温度变化，应与初始容差叠加考量总偏差。
- 直流偏置效应：高介电常数陶瓷对直流偏置敏感，实际工作电压下有效容值会明显下降，尤其当工作电压接近额定值时降幅更大。选型时应参考 TDK 的 DC-bias 曲线。
- ESR/阻抗：0805 高容值 MLCC 的等效串联电阻（ESR）与自谐频率受尺寸与介质影响，具体参数请参见厂方数据表以满足纹波电流与噪声抑制需求。
- 机械应力敏感：MLCC 易受 PCB 弯曲、焊接应力造成裂纹，需注意基板设计与焊接工艺。
四、典型应用
- 开关电源输入/输出去耦与缓冲
- 电源总线滤波和平滑
- 通信设备与消费电子的去耦与去噪
- 一般工业电子电路中的旁路与储能（非汽配等级应用，若用于汽车或高可靠性场合需确认是否通过 AEC 等认证）
五、封装与焊接建议
- 推荐遵循厂方的 PCB 焊盘尺寸建议，保证良好焊点与应力释放；避免过小焊盘导致焊盘拉力集中。
- 回流焊工艺应按照 J-STD-020 推荐的无铅回流曲线，峰值温度通常接近 260 ℃，严格控制升温速率与冷却曲线以降低热应力。
- 焊接后避免对封装施加弯曲或剪切力，装配时注意夹具与测试探针压力。
六、可靠性与选型建议
- 对于关键电源滤波或需保证一定容值的场合，务必参考厂方的 DC-bias、温度特性和等效电路参数。
- 若工作电压接近 25 V，建议考虑电压降额或选用更高额定电压/不同介质以保证剩余容值与稳定性。
- 储存与搬运按干燥封装要求处理，长期存放建议在原包装内并控制湿度；回流前若包装已开封，视情况进行烘烤处理。
- 在设计验证阶段，开展热循环、湿热、机械冲击与电气老化测试，以确认在目标应用中的表现与寿命。
总结：C2012X5R1E226MT000E 为适用于常规电源去耦与滤波的高容值 0805 MLCC，体积小、容量密度高，但在选型时应重点关注 DC-bias、温漂与机械应力影响，结合 TDK 官方数据表与应用曲线完成最终设计校核。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
