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TDK MLG1005S3N9ST000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S3N9ST000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S3N9ST000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 3.9nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0262574990
- Current
- 700mA
- Frequency
- 5GHz
- Resistor(DCR)
- 110mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S3N9ST000 — TDK 0402 贴片叠层电感产品概述
一、产品简介
MLG1005S3N9ST000 为 TDK 出品的一款0402（1005公制）贴片叠层电感，标称电感值 3.9 nH，直流电阻（DCR）110 mΩ，额定电流 700 mA，品质因数 Q = 8（测量条件：100 MHz），自谐振频率（SRF）约 5 GHz。器件体积小、适配高密度贴片工艺，适用于移动与射频前端电路中对小电感值、较好频率响应和中等功率承载能力的需求。
二、主要电气特性要点
- 电感值：3.9 nH，适合高频匹配与阻抗补偿。
- 额定电流：700 mA，适用于信号链和中低电流偏置场合，但不建议用于大电流电源滤波。
- 直流电阻：110 mΩ，导通损耗较低，有利于保持信号能量。
- 品质因数：8@100 MHz，表示在百兆级频段具有中等损耗性能，需结合应用频段评估。
- 自谐振频率：5 GHz，器件在此频率附近发生电感—寄生电容共振，实际工作频段应低于 SRF 以保证线性电感特性。
三、典型应用场景
- 射频匹配网络、阻抗变换与微带线补偿。
- 高频滤波器中的串联或并联电感元件（工作频率应在 SRF 以下）。
- 高频去耦、EMI 抑制与信号链隔离（对高频噪声有一定衰减效果）。
- 无线通信模块、射频前端、小型化消费类电子产品中的高密度布板应用。
四、设计与布局注意事项
- 将器件工作频率控制在自谐频率之下，靠近但低于 SRF 时要注意寄生电容影响。
- 贴片封装极小，焊盘与走线应尽量短且粗，减少附加寄生电感和串联电阻。
- 电流靠近额定值时，电感值可能出现直流偏置下降（电感随电流变化）；关键电路需要验证在工作电流下的实际电感。
- 高频应用建议靠近接入点放置，避免与大面积金属或敏感接收器件重叠造成耦合。
五、可靠性与工艺提示
- 适用于贴片回流焊工艺；建议按照 TDK 官方资料采用推荐的回流温度曲线与焊膏工艺，以避免热损伤或机械裂纹。
- 小体积器件在手工焊接或拆焊时易受机械应力影响，生产、检修过程中注意避免过度热冲击与弯折。
- 贮存与贴装应防潮、防尘，遵循元件包装标识和使用期限建议。
六、选型与替代建议
- 若需更高 Q 值或更大电流承载，应选择体积更大或专用高 Q 型号；若工作频率接近或超过 5 GHz，应选用 SRF 更高的型号。
- 采购时请参照 TDK 数据手册确认封装尺寸（0402 = 1.0 mm × 0.5 mm）与卷装规格，必要时索取样品并在目标电路中做频域与温升测试。
概述基于器件主要参数与通用设计原则，具体电气曲线、热特性与机械尺寸请以 TDK 官方数据表为准，设计验证请在目标板上完成实际测量。
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