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TDK CGA2B2C0G1H681JT0Y0F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK CGA2B2C0G1H681JT0Y0F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA2B2C0G1H681JT0Y0F
- Electronic Component
- 1
- Electronic Component
- 680pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0257238892
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA2B2C0G1H681JT0Y0F 产品概述
一、产品简介
CGA2B2C0G1H681JT0Y0F 为 TDK 推出的贴片多层陶瓷电容（MLCC），规格为 680 pF，容差 ±5%（J），额定电压 50 V，温度系数 C0G（亦称 NP0），封装 0402（公制 1005）。该产品以其优异的电气稳定性和低损耗特性，常用于对频率响应和温度漂移有严格要求的电路中。
二、主要性能特点
- 温度稳定性高：C0G（NP0）介质，温度系数接近 0，温漂极小，适合精密信号处理与计时电路。
- 低损耗、低介质吸收：高 Q 值、低损耗角，适用于高频、射频应用与滤波网络。
- 优良的容值稳定性：±5% 容差配合 C0G 温漂，长期稳定性好。
- 小型封装：0402 体积小，利于高密度贴片装配与空间受限设计。
- 工艺兼容：适用于无铅回流焊工艺，便于常规 SMT 生产线量产。
三、典型应用场合
- 高频滤波与阻容耦合（RF 前端、ADC/DAC 前端滤波）
- 精密定时与振荡电路（晶振旁路、相位噪声优化）
- 旁路与去耦（对噪声敏感的电源或模拟电路）
- 仪器仪表、通信设备与测量放大器等要求温漂低、长期稳定的场景
四、选型与使用建议
- 若电路对温漂与容值稳定性要求高，应优先选用 C0G/NP0 型号；在需要更大容量或更高电压时，考虑其它封装或介质系列。
- 0402 尺寸虽然节省空间，但在装配与维修时对焊接质量要求更高，推荐使用合适的锡膏和回流曲线，并注意焊盘设计以确保良好机械强度。
- 避免在超过额定电压或过高温度下长期使用，建议预留裕量以提升可靠性。
五、品质与供应
TDK 品牌产品制造工艺成熟，严格品质控制，符合 RoHS 等环保要求，适合工业级与商用电子产品的量产供应。如需进一步的电气参数曲线、尺寸图或可靠性测试数据，可向供应商索取完整规格书（Datasheet）。
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