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TDK MMZ0603S601HT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MMZ0603S601HT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MMZ0603S601HT000
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.009g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0262575925
- Operating Temperature
- 55℃~+125℃
- Current
- 280mA
- @Frequency
- 600Ω@100MHz
- Resistor(DCR)
- 750mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMZ0603S601HT000 产品概述
一、概述
MMZ0603S601HT000 为 TDK 系列磁珠抑制元件（Magnetic Bead），用于高频干扰抑制和信号/电源线的 EMI 滤波。该器件设计用于小型化应用，适合在空间受限的贴片电路中作为高频噪声抑制元件使用。基于您提供的参数，器件在 100 MHz 附近具有较高的阻抗特性，适合抑制中高频干扰。
二、关键参数
- 阻抗：600 Ω @ 100 MHz（标称，误差 ±25%）
- 直流电阻（DCR）：750 mΩ（典型值）
- 额定电流：280 mA（连续通过电流限制，超出可能导致阻抗下降或热升高）
- 通道数：单通道（1）
- 工作温度：-55 ℃ 至 +125 ℃
- 封装：0201（请注意型号中的 “0603” 与您提供的封装信息存在不一致，建议以实际物料表或厂商数据表为准）
三、应用场景
- 高速数字信号线、串行总线的共模/差模高频噪声抑制
- 手机、可穿戴设备与蓝牙/Wi‑Fi 模块附近的局部 EMC 改善
- 低电流供电轨（如参考电源、传感器供电）的高频滤波
- 对空间和寄生电容敏感的紧凑型 PCB 设计
四、封装与热、电性能注意事项
- 直流压降估算：在额定电流 280 mA 下，Vdrop ≈ I × DCR ≈ 0.28 A × 0.75 Ω ≈ 0.21 V，若用于电源线需评估电压损失与功耗。
- 温度与电流：高温环境或长期靠近热源时，阻抗可能下降或寿命受影响，建议参考厂商的电流-温升与频率特性曲线进行裕量设计。
- 焊接与可靠性：小尺寸封装对贴装工艺敏感，推荐遵循 TDK 的回流焊温度曲线及抗热循环规范，避免在大功率回流或二次焊接中超出推荐曲线。
五、选型建议与使用要点
- 若设计关键在于 100 MHz 附近的抑制效果，本件为合适选择；若需更宽频带或更低 DCR，应比较同系列或其他型号。
- 注意阻抗公差 ±25% 的实际变异，敏感电路建议在板级调试时测量实际效果。
- 对于电源用途，评估额定电流、直流压降和热耗散，必要时选用更大电流规格的磁珠或增加并联措施。
- 最终选型以 TDK 正式数据表为准，特别确认封装尺寸（0201 vs 0603）、频率特性曲线及回流焊工艺要求。
如需我帮您查找并核对 TDK 官方数据表或给出与其他型号的对比建议，请提供目标应用电流、工作频段与空间限制等信息。
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