Model & package intelligence
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TDK MLG0603P0N6BT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG0603P0N6BT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603P0N6BT000
- Electronic Component
- 1
- Package
- SMD
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.009g
- Inductor
- 0.6nH
- Electronic Component
- 1
- Electronic Component
- BM0058427587
- Current
- 1A
- Frequency
- 10GHz
- Resistor(DCR)
- 60mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG0603P0N6BT000 产品概述
一、产品简介
MLG0603P0N6BT000 为 TDK 出品的叠层贴片电感，标称电感值 0.6 nH，额定直流电流 1 A，直流电阻（DCR）约 10 mΩ，自谐振频率（SRF）≈ 10 GHz。封装注明为 0201（亦称 0603 公制），适用于对体积、寄生电抗和高频性能有严格要求的电子产品。
二、主要特性
- 极低电感量：0.6 nH，适合用于微量电感调谐与高频阻抗匹配。
- 高自谐振频率：10 GHz，可在微波频段保持感性行为，适合 GHz 级信号链。
- 低直流电阻：10 mΩ，有利于降低功耗和温升，支持高达 1 A 的额定电流。
- 叠层结构：体积小、温度与机械特性稳定，适合自动化贴装与批量生产。
三、典型应用
- 无线射频前端的匹配网络、窄带/宽带滤波器与陷波器。
- 高频 EMI 抑制、共模/差模抑制元件以及传输线阻抗微调。
- 手机、Wi‑Fi/BT 模块、GPS、蓝牙以及射频收发器的封装限制场合。
- 高速数字接口或电源去耦时对 GHz 频段行为的精细调整。
四、封装与焊接建议
- 封装为超小型贴片，建议使用精密贴片机和适配 0201 料带的取放头。
- 焊接遵循无铅回流规范（参考 JEDEC J‑STD‑020），峰值温度不超过 260°C，合理控制预热与回流时长以避免热应力。
- 贴装时建议减小焊盘延伸，保证端子形成良好锡角；避免在器件下方开通孔或过多过孔以免影响焊接稳定性。
- 清洗时选用对陶瓷/磁性材料安全的溶剂，避免长时间超声清洗。
五、电气特性与设计注意
- 在频率接近或超过 SRF 时，器件行为由感性转为容性，电路设计应考虑寄生电容与封装引线效应。
- 测量电感与 S 参数 时推荐使用校准良好的矢量网络分析仪与低寄生夹具，尽量缩短测试夹具引线以减少误差。
- 额定电流为最大连续值，实际应用应考虑裕度以降低温升与热退化风险；在高温或高功率场合应做热仿真或实际验证。
六、包装与采购提示
- 型号：MLG0603P0N6BT000，品牌：TDK，通常以卷带（reel）方式供货，便于贴片机直接取料。
- 采购时关注批次与规格一致性，必要时索取样片并在目标板上完成射频与热性能验证。
本产品适合对尺寸和高频性能要求严格的射频与高速应用场景，在电路布局和焊接工艺上给予适当控制，可发挥其低阻抗、高 SRF 的优势。
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