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TDK MLG0603P1N3BT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG0603P1N3BT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603P1N3BT000
- Electronic Component
- 1
- Package
- SMD
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.009g
- Inductor
- 1.3nH
- Electronic Component
- 1
- Factor
- 14@500MHz
- Electronic Component
- BM0265451447
- Current
- 800mA
- Frequency
- 10GHz
- Resistor(DCR)
- 30mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG0603P1N3BT000 产品概述
一、产品简介
MLG0603P1N3BT000 是 TDK 生产的一款叠层贴片电感，规格为 1.3 nH，适用于空间受限且工作频率较高的射频与高速电路。封装标注为 0201（0603 公制），体积极小，适合移动设备、无线模块及高密度 SMT 板级应用。
二、主要电气参数
- 电感值：1.3 nH
- 额定电流：800 mA（直流额定，通过电流时电感会因磁饱和或温升而下降，应参考厂家曲线）
- 直流电阻（DCR）：30 mΩ
- 品质因数（Q）：14 @ 500 MHz
- 自谐振频率（SRF）：约 10 GHz
- 类型：叠层电感（多层陶瓷结构，体积小、频率响应好）
三、关键性能特点
- 高频性能优异：Q 值在 500 MHz 时可达 14，SRF 高达 10 GHz，适合 VHF/UHF 及微波前端应用。
- 低 DCR 与较高额定电流：30 mΩ 的低直流电阻有利于降低寄生损耗，800 mA 的额定电流适合中等电流路径。
- 小型封装：0201（0603 公制）封装便于高密度 PCB 布局，减小器件占位。
- 良好的重复性与温度稳定性：叠层结构利于批量一致性，适合生产制造要求严格的场景。
四、典型应用场景
- 射频匹配网络与滤波器元件（RF matching、balun 补偿）
- VCO/PLL、低噪声放大器的偏置与隔离用电感
- 高频信号线的串联阻抗或短路旁路（作为小值电感实现频带选择）
- 移动通信、Wi‑Fi、蓝牙及毫米波前端模块中的阻抗调节与 EMI 管理
五、封装与装配建议
- 由于 0201 尺寸极小，建议使用精密贴装设备（真空吸嘴）并配合视觉对位。
- 推荐采用制造商给出的推荐焊盘尺寸和回流曲线，以避免焊接缺陷或热应力损伤。
- 多次重流可能影响可靠性，若板上有多次工艺，请参考 TDK 的热循环与余热指南。
- 存储时防潮包装为佳，避免吸潮导致焊接问题。
六、设计与测试要点
- 布局：尽量缩短与电感相连的走线，靠近源或负载放置以降低寄生电感/电容影响；必要时在布局中保留防止耦合的间距。
- 电流与电感偏置：在实际电流条件下，电感值会发生偏移，应参考厂方的电流-电感特性曲线并留有安全裕度。
- 高频测量：建议采用矢量网络分析仪（VNA）测量 S 参数，并通过去嵌（de-embed）方法去除焊盘与测试夹具影响，获得真实频率响应。
- 热管理：长期大电流运行会导致温升，从而影响电感值与寿命，设计时应评估最大功率耗散与 PCB 散热能力。
七、采购与质量控制
- 选型时确认具体批次的参数一致性与生产合格证，必要时索取样片进行评估。
- 小尺寸器件在贴装与检验环节更易出现遗漏或偏位，建议在生产工艺中增加 AOI/飞针测试以确保装配率与电气性能。
此器件以其小型化与高频特性，适合对体积与频率响应有严格要求的现代电子系统。选用时应综合考虑电流偏置、温升与 PCB 布局等因素，以发挥其最佳性能。
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