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TDK MLG0603S3N9ST000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG0603S3N9ST000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603S3N9ST000
- Electronic Component
- 1
- Package
- 0201
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.009g
- Inductor
- 3.9nH
- Electronic Component
- 1
- Factor
- 5@100MHz
- Electronic Component
- BM0058431428
- Current
- 300mA
- Frequency
- 5GHz
- Resistor(DCR)
- 270mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG0603S3N9ST000 产品概述
一、产品简介
TDK MLG0603S3N9ST000 是一款小型叠层贴片电感，封装为 0201（等效于 0603 公制），标称电感值 3.9 nH。该器件面向高频应用，体积极小、结构稳定，适合对空间要求严格的移动终端、射频模块和高密度 PCB 布局。
二、主要电气特性
- 电感值：3.9 nH（标称）
- 额定电流：300 mA（最大工作电流，超过会带来显著直流偏磁）
- 直流电阻（DCR）：约 270 mΩ（典型值，影响损耗与功耗）
- 品质因数（Q）：5 @ 100 MHz（说明在 100 MHz 附近损耗较高，适用于阻抗匹配或窄带滤波而非高 Q 共振回路）
- 自谐振频率（SRF）：约 5 GHz（在 SRF 以下呈电感性行为，在接近 SRF 时开始出现寄生电容影响）
- 类型：叠层电感（多层陶瓷结构，温度稳定性好）
这些参数表明该型号适合 GHz 级别以下的射频去耦、阻抗调谐和 EMI 抑制场景，但由较低的 Q 值和较高 DCR 可见其在低频功率传输中的损耗不可忽视。
三、典型应用
- 射频前端的小量级匹配元件与谐振回路
- PCB 上的 EMI 抑制与去耦（与电容配合形成阻尼或谐振网络）
- 高频传输线端的阻抗整形、滤波器的一部分
- 空间受限的移动设备、蓝牙/Wi‑Fi/蜂窝通信模块、GPS 前端
四、封装与安装建议
- 封装：0201 超小型贴片，要求精细贴装工艺和高精度贴片机。
- 焊接：建议采用回流焊工艺，遵循无铅回流温度曲线和 PCB 材料的耐热规范；避免手工焊接长时间加热。
- 焊盘设计：由于体积极小，应参照 TDK 推荐的焊盘尺寸与焊膏印刷参数，保证焊点可靠性与电气连接性。
- 机械应力：贴片电感对 PCB 弯曲与热应力敏感，装配和测试过程中避免强力推挤或刮擦。
五、选型要点与注意事项
- 工作频率与 SRF：使用频率应明显低于 5 GHz，否则电感行为会被寄生电容主导。
- 损耗与效率：DCR 较高、Q 值较低，若电路对损耗敏感（如低噪声放大器输出），应考虑更高 Q 或更低 DCR 的替代器件。
- 电流裕量：额定电流 300 mA，若电路短时冲击或持续大电流，需留足裕量以避免磁饱和或温升。
- 公差与温度特性：具体电感公差与温度系数以产品规格书为准，关键应用请参考完整数据表或向厂家咨询。
六、可靠性与测试
- 典型可靠性试验包括温度循环、湿热、机械冲击和焊接热稳定性测试，应满足行业环境应力要求。
- 建议在最终产品中进行实际频域和时域测试（如 S 参数、插入损耗、寄生电容测量）以验证在目标频点的行为。
- 采购与库存：选择正规渠道购买，并关注批次差异对高频特性的影响。
如需进一步的电气参数曲线、封装尺寸图或推荐焊盘，建议索取并仔细阅读 TDK 的产品规格书与应用说明，以确保在目标应用中的性能与可靠性。
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