Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MLG0603PR12JT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG0603PR12JT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603PR12JT000
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.009g
- Inductor
- 120nH
- Electronic Component
- 1
- Factor
- 9@300MHz
- Electronic Component
- BM0265451445
- Current
- 80mA
- Frequency
- 800MHz
- Resistor(DCR)
- 3.79Ω
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG0603PR12JT000 产品概述
一、产品简介
MLG0603PR12JT000 是 TDK 旗下的一款表面贴装小型电感，标称电感值 120 nH，公差 ±5%，额定直流电流 80 mA。封装标识为 0201（0603 公制），适用于高密度 SMT 设计与小型化电子设备。
二、主要电气参数
- 电感值：120 nH ±5%
- 额定电流：80 mA
- 直流电阻（DCR）：3.79 Ω
- 品质因数（Q）：9 @ 300 MHz
- 自谐振频率（SRF）：800 MHz
三、性能特点
该器件体积小、适合高频工作。在 300 MHz 附近表现出中等 Q 值（≈9），自谐振频率高达 800 MHz，能够在 VHF/UHF 频段作为阻抗元件或谐振元件使用。较高的 DCR 表明在直流或低频下会有较大压降，应在设计时考虑功耗与发热。
四、典型应用场景
适用于射频电路的阻抗匹配、滤波网络、谐振回路、射频前端及 EMI 抑制场合。由于额定电流较低，更适合信号链路或低功率射频模块，而非大电流电源滤波。
五、PCB 布局与焊接建议
- 尽量缩短连接引线，减少寄生电感与电容影响高频特性。
- 避免在元件下方布置大面积金属以改变 SRF，必要时在附近保持适当间距。
- 0201 尺寸需要精密贴装与回流焊控制，建议参照 TDK 推荐回流曲线与焊盘尺寸。
- 由于 DCR 较高，注意热量集中，必要时在设计中留有散热空间。
六、选型要点与注意事项
选择时需权衡电感值与自谐频率、Q 值和实际工作频段；若电路存在较大直流偏置或电流超过 80 mA，应选用额定电流更高的型号。有关环境合规、封装详细尺寸和可靠性（温度系数、焊接可靠性等），请以 TDK 官方数据手册为准。
本概述提供快速参考，具体电路应用建议进行仿真验证与样机测试。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
