WMSIC Electronic Components

TDK MLG0603P1N5BT000

ModelMLG0603P1N5BT000
PackageSMD
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MLG0603P1N5BT000
Type
TDK
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MLG0603P1N5BT000
Electronic Component
1
Package
SMD
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
0.009g
Inductor
1.5nH
Electronic Component
1
Factor
14@500MHz
Electronic Component
BM0058427592
Current
800mA
Frequency
10GHz
Resistor(DCR)
30mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MLG0603P1N5BT000 产品概述

一、产品简介

MLG0603P1N5BT000 是 TDK 推出的叠层贴片电感,封装标注 0201(0603 公制),电感值 1.5 nH,额定电流 800 mA,直流电阻(DCR)30 mΩ,品质因数 Q=14(500 MHz),自谐振频率(SRF)约 10 GHz。该器件针对高频微波和射频通路的小型化滤波、阻抗匹配及去耦场景优化设计。

二、主要特性

  • 极小尺寸(0201/0603),便于高密度 PCB 布局与尺寸受限应用
  • 低 DCR(30 mΩ),在直流和低频时功耗小、热耗低
  • 较高 SRF(10 GHz),适用于 GHz 级信号路径
  • Q 值 14@500 MHz,表现出色的频率选择性与滤波能力
  • 额定电流 800 mA,满足多数射频前端与供电偏置电流需求

三、典型应用

  • 射频前端网络:滤波、谐波抑制与阻抗匹配
  • 高频通信模块:Wi-Fi、LTE/5G 子系统的带内/带外抑制
  • 高频去耦与偏置元件:功率放大器偏置网络、射频开关
  • 精密仪器与测试设备中的微波信号链路

四、布局与使用建议

  • 尽量靠近噪声源或放大器偏置端放置以降低寄生引入
  • 严格控制焊盘与走线长度,避免引入额外串联电感和寄生电容
  • 在高频路径上以同轴或差分匹配思路布线,必要时辅以地平面隔离
  • 考虑热管理,连续高电流应用应评估温升与可靠性

五、可靠性与选型注意

  • 适用于商用至工业等级的一般温度范围,具体环境应参考 TDK 数据手册
  • 小封装在回流焊工艺中需注意平台温度和焊接曲线以防机械损伤
  • 若需更高电流或更低 DCR,可选型相邻尺寸或功率级别型号进行比较

该产品以其超小尺寸与良好高频特性,适合需要小型化与高频性能平衡的射频及微波应用。选型时请结合完整器件数据手册确认频率响应、温度特性与封装应力要求。

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