WMSIC Electronic Components

TDK MHQ1005P1N2BT000

ModelMHQ1005P1N2BT000
PackageSMD
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MHQ1005P1N2BT000
Type
TDK
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MHQ1005P1N2BT000
Electronic Component
1
Package
SMD
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
0.012g
Inductor
1.2nH
Electronic Component
1
Electronic Component
BM0262575477
Current
1.2A
Frequency
13GHz
Resistor(DCR)
30mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MHQ1005P1N2BT000 产品概述

一、概述

MHQ1005P1N2BT000 是 TDK 叠层贴片电感(SMD),标称电感值 1.2 nH,额定电流 1.2 A,直流电阻(DCR)约 30 mΩ,自谐振频率(SRF)高达 13 GHz。0402(公制 1005)超小封装使其在空间受限的高频射频与高速数字应用中具有明显优势。该器件以低损耗、宽频带特性和良好的电流承载能力,适合前端滤波、阻抗匹配及频带隔离等场合。

二、主要性能参数

  • 电感值:1.2 nH(标称)
  • 额定电流:1.2 A(连续工作限值)
  • 直流电阻:约 30 mΩ(低电阻、低功耗)
  • 自谐振频率:13 GHz(适用于微波及毫米波部分应用)
  • 类型:叠层电感(多层陶瓷结构)
  • 封装:SMD 0402(1005 公制)

三、频率与电气特性说明

  1. 高 SRF(13 GHz)意味着在 GHz 级别仍能保持电感性特性,适用于射频前端、滤波网络与阻抗调整。
  2. 低 DCR(约 30 mΩ)有助于在通过较大直流电流时降低功耗与热升,改善插入损耗。
  3. 标称电感值通常在低频时测得,实际工作中的感值会随频率和直流偏置电流发生变化,设计时应考虑寄生电容与电流系数效应。

四、典型应用场景

  • 手机、无线模块射频前端的阻抗匹配与窄带滤波
  • Wi‑Fi、蓝牙与蜂窝通信(含部分 5G 子系统)射频网络
  • 高速收发器、时钟分配与互连网络的杂散抑制与阻抗调理
  • 电源滤波中的高频去耦与共模抑制(在电流与频率匹配的前提下)

五、封装与布局建议

  • 采用 0402 超小封装,布板时应确保焊盘与过孔布局符合厂商推荐尺寸,以保证焊接可靠性与电性能一致性。
  • 走线尽量短且宽,减少寄生电感与串扰;在射频通路中尽量靠近用点放置以减少寄生电容和走线长度。
  • 对于高频应用,避免在电感附近增加大面积铜箔或接地窗,以免改变元件寄生参数。

六、选型与可靠性注意事项

  • 在选型时验证器件在目标频段的插入损耗与相位响应,建议通过 S‑参数测量获取真实性能。
  • 若工作电流接近或超过额定 1.2 A,应评估温升与长期老化影响并给出适当裕量。
  • 叠层陶瓷结构对机械应力与焊接温度敏感,推荐采用符合无铅回流的标准工艺曲线并做好抗震与可靠性验证。

七、总结

MHQ1005P1N2BT000 是一款面向高频应用的微型低损耗叠层电感,兼具高自谐振频率与较好的电流承载能力,适合空间受限且对频带性能要求高的射频与高速电路。设计时应结合实测频率响应、热管理与 PCB 布局优化,以发挥其在系统中的最佳性能。若需更详细的封装尺寸、回流曲线或频率特性曲线,建议参阅 TDK 官方数据手册或与供应商技术支持联系。

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