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TDK C1005X5R1C104KT000F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- TDK C1005X5R1C104KT000F
- Type
- TDK
- Minimum package
- 10000
Technical parameters
- Electronic Component
- TDK
- Electronic Component
- C1005X5R1C104KT000F
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0258756569
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1005X5R1C104KT000F 产品概述
一、产品简介
TDK 型号 C1005X5R1C104KT000F 是一款通用型多层陶瓷片式电容（MLCC），规格为 100nF（0.1µF）、初始精度 ±10%（标记 K），额定电压 16V，介质材料为 X5R，封装为 0402（公制 1005，约 1.0 × 0.5 mm）。该器件适用于空间受限的表贴电路板，常作为旁路、去耦和滤波元件使用。
二、主要参数
- 容值：100nF（104）
- 精度：±10%（K）
- 额定电压：16V
- 介质：X5R（温度范围 -55°C ～ +85°C，按标准温度变化允许电容有较大波动）
- 封装：0402（1005 公制）
- 品牌：TDK
三、特点与优势
- 体积小、容量密度高，适合高密度布板与微型化设计。
- X5R 介质在中等温度范围内具有较好的容值稳定性，适合一般电子产品的旁路与去耦需求。
- 0402 封装利于高频性能与短布线，能有效降低寄生电感（ESL）。
- TDK 品牌保证制造与质量控制，适合大批量量产应用。
四、典型应用场景
- 微处理器、ASIC、SoC 的电源去耦与旁路。
- 电源管理模块（DC-DC 转换器）的输入/输出滤波。
- 射频前端及高速数字电路中的去耦与去噪。
- 一般电子设备中的耦合、退耦和滤波网络。
五、使用与设计注意事项
- X5R 器件存在显著的直流偏压（DC bias）效应，施加工作电压时电容值会下降，关键电路请留有裕量或选用额定电压更高的型号。
- X5R 温度特性相较于 C0G/NPO 稳定性差，如用于高精度定时或滤波，应考虑温度系数影响。
- 推荐遵循 TDK 的回流焊工艺与温度曲线（无铅回流峰值请参照厂方资料），以保证焊接可靠性。
- 由于 0402 体积小，贴装与维修对料带、贴片机参数与回焊工艺要求较高，应做好工艺验证。
六、封装与采购信息
- 常见包装形式为卷盘（Tape & Reel），适合自动化贴装。
- 购买时请确认完整料号以获取正确的温度系数、精度与包装信息；如需更高电压或更稳定温特性，可选用相近系列（如 X7R、C0G）或更高额定电压件。
七、选型建议
- 若电路对温漂与线性要求高，建议改用 C0G（NP0）介质。
- 若需在更宽温度范围或更高电压下工作，可考虑 X7R 或更高额定电压的封装/型号。
- 对于关键去耦，考虑并联不同容值与不同介质，以兼顾低频与高频性能。
八、总结
C1005X5R1C104KT000F 是一款适合常规去耦、滤波与旁路的通用型 0402 MLCC，兼具小尺寸与较高容量，适用于移动设备、通信与消费电子等空间受限且需高密度布板的场景。设计时注意 DC bias 与温度特性，并按 TDK 工艺规范实施贴装与回流焊接，可确保长期可靠性与性能稳定。
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