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TDK C0603C0G1E101JT00NN
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK C0603C0G1E101JT00NN
- Type
- TDK
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- C0603C0G1E101JT00NN
- Electronic Component
- 1
- Electronic Component
- 100pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0258885425
- Electronic Component
- C0G
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C0603C0G1E101JT00NN 产品概述
一、产品简介
C0603C0G1E101JT00NN 为 TDK 系列贴片多层陶瓷电容（MLCC）型号，依据提供参数说明其主要电气规格为：容值 100 pF，公差 ±5%，额定电压 25 V，温度系数为 C0G（又称 NP0）。文中按用户给定封装 0201 进行描述（注：型号中包含 C0603 字样，若实际采购请以实物或供应商数据表为准）。
二、主要特性
- 稳定的温度特性：C0G 陶瓷介质具有接近零的温漂，适合对温度敏感的定时和滤波电路。
- 低损耗、高 Q 值：介质损耗小，适合高频信号路径和射频前端的旁路、耦合与滤波应用。
- 优良的长期稳定性与可靠性：在正常应力范围内容值变化小，适合精密参考和采样电路。
- 小尺寸封装（0201）：便于高密度 PCB 设计，节省空间，但对贴装工艺要求较高。
三、典型应用场景
- 高频旁路与去耦（RF/微波级附近频段）
- 精密滤波、振荡器负载与定时网络
- ADC/DAC 参考滤波与采样电路
- 移动设备、可穿戴设备、IoT 终端及其他空间受限的消费电子产品
四、设计与选型建议
- 电压与容值匹配：C0G 具备良好电压稳定性，但在高偏压环境仍建议预留裕量；若工作电压接近 25 V，应考虑电压裕度或选择更高额定电压型号。
- 封装权衡：0201 有利于减小 PCB 面积，但若生产可焊性或可靠性是优先项，可考虑升为 0402/0603 以降低装配风险。
- 高频设计注意：保持短回流路径、合适的地平面和阻抗控制，以充分发挥 C0G 的高频性能。
- 并联与去耦策略：在宽频带去耦中，可与较大容值的电容并联使用以覆盖低频响应。
五、焊接与可靠性要点
- 贴装工艺：0201 尺寸对贴片机精度、锡膏印刷模板和回流曲线敏感，需优化焊膏量与印刷开窗。
- 回流温度：遵循 TDK 推荐回流曲线，避免过高热应力造成裂纹或性能劣化。
- 机械应力防护：在可能机械冲击或弯曲应力较大的应用中，应考虑应力缓冲设计或改用更大封装，以减少裂片和焊点剥落风险。
- 检验与可靠性验证：批量生产前建议进行焊后外观、X 光和功能性测试，并做加速老化/热循环验证。
六、采购与封装信息
- 包装形式通常为卷带（Tape & Reel），适配自动贴片生产线。
- 采购时请核对完整料号、封装与批次，并优先从授权代理或官方渠道获取，以保证原厂品质与追溯。
总结：该型号以 C0G 介质和 100 pF 容值为核心优点，适合对温度稳定性和高频性能有较高要求的应用。若在封装或额定电压上存在特殊需求，建议在选型时与供应商确认具体数据表并评估贴装可靠性。
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