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TDK MLF2012DR33JT000
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLF2012DR33JT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLF2012DR33JT000
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.042g
- Inductor
- 330nH
- Electronic Component
- 1
- Factor
- 20@25MHz
- Electronic Component
- BM0255087585
- Current
- 250mA
- Frequency
- 200MHz
- Resistor(DCR)
- 230mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLF2012DR33JT000 产品概述
一、主要参数与标识
MLF2012DR33JT000 为 TDK 系列贴片电感器（封装 0805 / 2012 公制）。主要参数如下：标称电感值 330 nH，公差 ±5%；额定直流电流 250 mA；直流电阻（DCR）约 230 mΩ；品质因数 Q = 20（测量频率 25 MHz）；自谐振频率（SRF）约 200 MHz。器件标识常以型号 MLF2012DR33JT000 或简写 330nH@0805 表示。
二、特性与性能解读
- 中高频特性：Q 值 20（25 MHz）表明在中高频滤波与匹配网路中保持较好的能量选择性和较低的损耗。
- 自谐振频率：约 200 MHz，低于该频率器件主要表现为电感性，高于 SRF 后寄生电容会主导响应，需避免在 SRF 附近作为纯电感使用。
- 电阻与发热：DCR 230 mΩ 与额定电流 250 mA 联合决定 I²R 损耗与温升，在靠近额定电流工作时应考虑功耗及温升对电感值的影响。
- 公差与一致性：±5% 公差适合对电感精度有一定要求的射频前端、滤波匹配及去耦应用。
三、典型应用场景
- 高频滤波器与阻抗匹配：用于无线通信、蓝牙、Wi‑Fi 等射频前端的滤波和匹配网络（工作频率宜低于 SRF）。
- 电源去耦与共模抑制：在供电线路中作为小电流滤波元件，改善纹波与噪声，但需注意 DC 偏置下电感值下降。
- 谐振网络与谐振电路：适用于需要中低电感值且体积受限的过滤或谐振场合。
四、选型与使用建议
- 考虑 DC 偏置效应：工作电流接近额定值时电感值会下降，建议预留裕量或在数据表中查找电感随偏置电流的曲线。
- 避开 SRF 区域：若电路工作频率接近或超过 200 MHz，应选择 SRF 更高的型号或采用并联/串联网络优化。
- 热管理与布局：遵循短回流焊垫、尽量缩短走线的布板原则，避免靠近高热源，以减小温升对电感性能的影响。
- 焊接工艺：兼容常规回流焊工艺，注意回流曲线与湿热循环对可靠性的影响。
五、可靠性与替代方案
TDK 产品经过常规可靠性验证，适合工业级应用。若需更高电流承载、更低 DCR 或更高 SRF，可考虑更大封装或不同材质/结构的电感器进行替代选型。选择时以实际工作频率、允许损耗与板面空间为主导因素。
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