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TDK MLG0603P2N9BT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG0603P2N9BT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603P2N9BT000
- Electronic Component
- 1
- Package
- 0201
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.009g
- Inductor
- 2.9nH
- Electronic Component
- 1
- Factor
- 14@500MHz
- Electronic Component
- BM0262575914
- Current
- 500mA
- Frequency
- 7.5GHz
- Resistor(DCR)
- 100mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG0603P2N9BT000 产品概述
一、概述
MLG0603P2N9BT000 为 TDK 系列叠层贴片电感，标称电感值 2.9 nH，适用于对体积、寄生电容和自谐性能有较高要求的高频电路。器件体积小、性能稳定，适合现代微型化射频与高速信号设计中作为阻抗匹配、滤波或谐振元件使用。
二、主要电气参数
- 电感值：2.9 nH
- 额定电流：500 mA（连续电流能力）
- 直流电阻（DCR）：约 100 mΩ
- 品质因数（Q）：14 @ 500 MHz（指示在 500 MHz 下的能量损耗情况）
- 自谐振频率（SRF）：7.5 GHz（工作频率应低于 SRF，以避免寄生电容主导）
- 类型：叠层电感（MLG），封装：0201（超小贴片）
三、典型应用
- 射频匹配网络与微带滤波器中的阻抗调节与谐振单元
- 射频前端（RF front-end）的偏置与隔离电感
- 高速接口的共模/差模滤波（在配合其他元件时）
- 射频振荡器与平衡/不平衡转换网络中作为微小电感量元件
四、版图与焊接建议
- 为降低寄生电感与串联阻抗，元件引脚到活跃器件的连接应尽量短且走直线；避免在电感两端引入长走线或不必要的弯折。
- 采用厂家推荐的焊盘尺寸与过孔规则，确保可靠焊接与热扩散。0201 封装对贴装精度要求高，回流温度曲线请参考 TDK 产品说明书以避免开裂或性能退化。
- 对于高频应用，应通过仿真验证元件放置位置对周边电磁场与阻抗的影响。
五、选型与注意事项
- 若工作频率接近 SRF，应选择 SRF 明显高于工作频率的型号；一般建议工作频率不超过 SRF 的 1/3~1/2，以保留良好电感特性。
- DCR 较高时会降低电路的 Q 值并增加功耗，若对损耗敏感可考虑更大封装或低 DCR 型号；反之，0201 封装适合空间受限但电流与损耗要求适中的场景。
- 额定电流 500 mA 为连续通电极限，瞬态电流和温升需在系统级热设计中验证。
六、包装与可靠性
- TDK 的叠层电感通常提供卷带包装，适合高速贴片生产线。具体包装形式、抽样检验、温度循环、冲击与振动等可靠性数据请参阅厂家完整规格书与认证报告，以满足终检与环境测试需求。
总结：MLG0603P2N9BT000 以其超小体积与 7.5 GHz 的自谐振性能，适合移动通信、无线模块及射频前端的小型化设计。为保证最终性能，请结合电路频段、损耗与热管理要求，参照 TDK 规格书进行系统级验证与布局优化。
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