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TDK MPZ1608S600ATDH5
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MPZ1608S600ATDH5
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MPZ1608S600ATDH5
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0228288741
- Operating Temperature
- 55℃~+125℃
- Current
- 3.5A
- @Frequency
- 60Ω@100MHz
- Resistor(DCR)
- 20mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MPZ1608S600ATDH5 产品概述
一、主要参数
MPZ1608S600ATDH5 为 TDK 0603 封装磁珠，主要电气参数如下：直流电阻（DCR）约 20 mΩ；标称阻抗 60 Ω @ 100 MHz；公差 ±25%；额定直流电流 3.5 A；工作温度范围 -55 ℃ 至 +125 ℃；通道数：1。适用于需要在高频段实现噪声抑制同时保持低压降的设计场景。
二、特点及优势
- 高频抑制效果明显：在 100 MHz 附近具有 60 Ω 阻抗，有效衰减射频干扰与共模/差模噪声。
- 低直流阻抗与高额定电流：20 mΩ 的低 DCR 配合 3.5 A 的电流容量，适合电源线和大电流信号线，减少功率损耗与压降。
- 宽温度范围与封装小型化：-55～+125 ℃ 工作温度和 0603（1608） 封装，便于移动设备与板上密集布局。
三、典型应用
适用于手机、平板、笔记本、通信设备及消费电子中电源滤波、USB/HDMI/PCIe 等高速接口的去耦与 EMI 抑制，亦可用于开关电源（DC-DC）输入/输出端的噪声控制。
四、使用建议与 PCB 布局
- 靠近干扰源或被保护端放置（如芯片电源引脚或接口供电口），以缩短回路路径。
- 两端尽量直接焊接至铜箔，不建议在磁珠两端串联过多过长走线。
- 对于大电流路径关注热量与电阻引起的温升，必要时做热仿真或测量；在高直流偏置下阻抗可能下降，应在实际工况下验证。
- 焊接工艺按无铅回流曲线执行，注意湿敏等级与储存条件。
五、可靠性与选型参考
TDK 产品通常符合 RoHS 要求并通过常规温度循环、振动和焊接可靠性测试。选型时除阻抗与电流外，还应关注频率特性曲线、DC bias 下的阻抗衰减及封装兼容性；若需多通道或更高抑制，可考虑磁珠阵列或复合滤波方案。
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