Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MLG1005S33NJTD25
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLG1005S33NJTD25
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S33NJTD25
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Inductor
- 33nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0259717936
- Electronic Component
- AEC-Q200
- Current
- 300mA
- Frequency
- 1.4GHz
- Resistor(DCR)
- 590mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S33NJTD25 产品概述
一、产品简介
MLG1005S33NJTD25 是 TDK 推出的车规级无屏蔽多层片式电感，额定电感值 33 nH，公差 ±5%。本器件采用 0402（1005 公制）超小封装，专为空间受限、对可靠性要求高的汽车与消费电子应用设计，符合 AEC‑Q200 汽车级可靠性规范。
二、主要性能参数
- 电感值：33 nH，精度 ±5%
- 额定直流电流：300 mA（最大工作电流）
- 直流电阻（DCR）：典型 590 mΩ，批次或温升情况下最大可达约 900 mΩ
- 品质因数（Q）：8 @ 100 MHz
- 自谐振频率（SRF）：约 1.4 GHz
- 屏蔽形式：无屏蔽（unshielded）
- 封装尺寸：0402（1005 公制）
- 车规等级：AEC‑Q200
三、结构与封装特点
该器件为多层陶瓷/薄膜电感结构，体积极小但能在高频段保持稳定的电感特性。无屏蔽设计在散热与成本上有优势，但在电磁兼容（EMC）上对布局要求更高。0402 封装便于高密度贴装，适配自动化贴片流程。
四、典型应用场景
- 汽车电子：收发器滤波、射频匹配、抑制高频干扰的去耦/谐振网络
- 通信设备：滤波网络、阻抗匹配、噪声抑制
- 移动设备与可穿戴：高频信号路径的微型滤波元件
- 工业控制与传感器前端：抗干扰与匹配应用
五、选型与 PCB 布局建议
- 考虑自谐振频率与工作频段关系，避免在 SRF 附近工作以防寄生电容主导响应。
- 对于大电流或高 DC 偏置场合，应进行实际电流-电感衰减测量并留有裕量（额定 300 mA 为参考值）。
- 安装时采用与制造商推荐焊盘一致的落板设计，短引线、短回流路径有助于降低寄生电感与噪声耦合。
- 由于为无屏蔽结构，建议与敏感器件保持适当间距，必要时在 PCB 上增加地线隔离或屏蔽层以改善 EMC 表现。
六、可靠性与检验
器件通过 AEC‑Q200 认证，适用于汽车级工作温度与循环条件。常规进厂检验建议包括：外观、尺寸、LCR 参数测试（在工作频点及直流偏置下的电感值）、DCR 测量以及高温高湿、热冲击抽样测试，确保批次稳定性。
七、选型提示与采购
在选型时确认工作频段、允许电流与容许温升，必要时向供应商索取详细频率响应曲线与电流衰减曲线。型号 MLG1005S33NJTD25 适合在对体积与车规可靠性有严格要求的场合使用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
