WMSIC Electronic Components

TDK DEA162690LT-5051B1 DEA162690LT

ModelDEA162690LT-5051B1
PackageSMD-4P,1.6x0.8mm
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK DEA162690LT-5051B1
Type
SMD-4P, 1.6X0.8MM
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
DEA162690LT-5051B1
Electronic Component
1
Package
SMD-4P,1.6x0.8mm
Electronic Component
RFFilter
Electronic Component
0.07dB
Electronic Component
42dB;49dB
Electronic Component
0.033g
Electronic Component
50Ω
Electronic Component
1
Electronic Component
BM0227549353
Operating Temperature
40℃~+85℃
Electronic Component
0.5dB
Filter Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DEA162690LT-5051B1 产品概述

一、主要特点

DEA162690LT-5051B1 是 TDK 推出的高性能低通射频滤波器,中心截止频率设计为 1.6815 GHz,面向紧凑型射频前端应用。该器件在 50 Ω 传输线上表现优异,具有极低的通带纹波(0.07 dB)和极小的插入损耗(0.5 dB),适合对信号完整性要求较高的系统。工作温度范围为 -40 ℃ 至 +85 ℃,满足工业级温度规范。

二、典型电性能

  • 滤波类型:低通(Low-pass)
  • 截止/设计频率:1.6815 GHz
  • 系统阻抗:50 Ω
  • 通带纹波:0.07 dB(典型)
  • 插入损耗:0.5 dB(典型)
  • 工作温度:-40 ℃ ~ +85 ℃

这些参数保证了在所述频段下最小的通带衰减与极佳的幅度平坦性,从而有效抑制带外干扰并保持接收/发射链路的线性与灵敏度。

三、封装与机械特性

该器件采用 SMD-4P 封装,尺寸为 1.6 × 0.8 mm,适合高密度贴装与空间受限的模块化设计。小尺寸有利于在移动设备、无线模块及紧凑型基站单元中实现体积最小化,同时降低寄生效应对性能的影响。

四、典型应用场景

  • 移动通信射频前端与收发器滤波
  • 无线接入设备、基站与小型基站单元(Small Cell)
  • IoT 无线模块与终端
  • 测试测量设备的信号整形与带外抑制
  • 任何需在 ~1.7 GHz 附近保持低损耗和低纹波的射频系统

五、工程与封装使用建议

  • PCB 布局:建议采用 50 Ω 微带或带状线设计,滤波器输入/输出端到器件的过孔与走线尽量短,周围应有连续地平面地(GND)并做地穿孔(via)环绕以降低辐射与串扰。
  • 焊接工艺:支持标准回流焊工艺。为保证可靠焊接与热循环稳定性,建议遵循元件供应商的回流温度曲线与焊接工艺规范。
  • 机械防护:避免在回流后对器件施加过大机械应力,贴装过程中注意不要挤压封装边缘。
  • 温度与环境:在极端环境或严苛振动条件下,请在工程评估阶段进行可靠性测试以验证长期性能。

六、采购与技术支持

DEA162690LT-5051B1 由 TDK 生产,可通过正规分销渠道采购。建议在设计初期索取器件数据手册与典型 S-参数文件(S21、S11),以便在仿真工具中进行外形与系统级匹配验证。如需高阶定制或批量可靠性数据,可联系 TDK 或授权代理获取更多工程支持。

总结:DEA162690LT-5051B1 以其低插入损耗、极低通带纹波和小型 SMD 封装,适用于对信号质量要求苛刻且空间受限的射频设计,是 1.6815 GHz 附近滤波需求的优选方案。

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