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TDK MLF1608DR33JT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLF1608DR33JT000
- Type
- TDK
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLF1608DR33JT000
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.028g
- Inductor
- 330nH
- Electronic Component
- 1
- Factor
- 15@25MHz
- Electronic Component
- BM0262575481
- Current
- 100mA
- Frequency
- 230MHz
- Resistor(DCR)
- 400mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLF1608DR33JT000 产品概述
一、产品简介
MLF1608DR33JT000 为 TDK 推出的贴片电感，封装为 0603（1608 公制），标称电感值 330 nH，公差 ±5%。该器件适用于空间受限的 SMD 布局，提供较好的高频性能与重复性，常用于射频/滤波与电磁兼容电路中作为小型电感元件。
二、主要技术参数
- 电感值：330 nH ±5%
- 额定直流电流：100 mA
- 直流电阻（DCR）：400 mΩ
- 品质因数（Q）：15 @ 25 MHz
- 自谐振频率（SRF）：230 MHz
- 封装：0603（1608）表面贴装，品牌：TDK
三、性能与特性
- 在 25 MHz 时 Q≈15，表示在中低频范围内具有中等能量储存与损耗特性，适合谐振或阻断用途。
- 自谐振频率 230 MHz，工作频率远低于 SRF 时表现为理想电感。建议设计工作频率保持在 SRF 的约 1/3–1/5 以下，以避免寄生电容引起的谐振与电感下降。
- 直流电阻 400 mΩ，按额定电流 100 mA 计算，电压降约 40 mV，功耗约 4 mW，适合低功耗信号链与滤波应用。
- 额定电流为磁芯开始出现明显电感下降或饱和前的参考值，实际使用时应预留裕量以避免磁饱和导致的性能退化。
四、典型应用场景
- 射频前端滤波、谐振回路与阻抗匹配（低频至中频段）。
- EMI 抗扰与共模/差模滤波器（与电容配合形成 LC 低通/带阻）。
- 通信设备、传感器接口、时钟与中频（IF）电路中的阻塞或去耦元件。
- 空间受限的消费电子与可穿戴设备电路。
五、使用与设计注意事项
- 安装：兼容常规无铅回流焊工艺。为获得可靠焊点与机械强度，建议按 TDK 推荐的焊盘尺寸与过孔布局进行 PCB 设计，避免在贴装后对焊盘施加机械应力。
- 电流与热：若工作电流接近或超过额定值，电感值可能下降并导致温升，建议预留 20–30% 的电流裕量。
- 布局：将电感与高频信号源、接地平面合理布置，避免强耦合的噪声源靠近以减少寄生影响。必要时添加屏蔽或隔离措施。
- 清洗与可靠性：选择与元件兼容的清洗方法与助焊剂，严格控制回流曲线与焊接工艺以保证长期可靠性。
六、包装与可靠性
TDK 标准化封装与检测流程保证批次一致性，适用于自动贴片与大批量生产。出货时通常提供卷带包装，便于 SMT 贴装与仓储管理。用户在关键应用中可参考厂方完整数据手册获取环境应力、温度特性与机械可靠性试验数据以进行可靠性评估。
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