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TDK MLZ2012N4R7LT000
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLZ2012N4R7LT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLZ2012N4R7LT000
- Electronic Component
- 1
- Package
- 0805
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.042g
- Inductor
- 4.7uH
- Electronic Component
- 1
- Electronic Component
- BM0265596745
- Current
- 600mA
- Resistor(DCR)
- 180mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLZ2012N4R7LT000 产品概述
一、产品简介
MLZ2012N4R7LT000 是 TDK 推出的贴片叠层电感，标称电感值为 4.7 µH，公差 ±20%。该器件采用 0805（2012 公制）封装，体积小、适合高密度贴片组装，主要用于走线滤波、去耦与 EMI 抑制等场合。
二、主要电气参数
- 标称电感：4.7 µH ±20%
- 饱和电流（Isat）：130 mA（指在规定条件下电感值下降到一定比例时的电流）
- 直流电阻（DCR）：约 180 mΩ
- 额定电流：600 mA（指在规定温升限制下的允许通过电流）
- 类型：叠层片式电感（多层陶瓷结构）
注：Isat 与额定电流表示不同的限值，Isat 反映磁性材料在直流偏置下电感下降的临界点；额定电流主要受温升限制影响。设计时需同时参考两者，防止在工作电流下电感有效值明显下降或温升超标。
三、物理与可靠性特点
- 封装：0805（约 2.0 × 1.25 mm）小型贴片，适合自动贴装与回流焊工艺。
- 结构：叠层陶瓷设计，体积小且成本较低。
- 可靠性：适合一般消费电子与工业应用，建议按制造商焊接曲线回流，并注意板面挠曲与机械应力。
四、性能注意事项
- 直流偏置效应：叠层电感在直流偏置下电感值会下降，Isat 比较低（130 mA），在接近或超过此值时电感值会显著降低，应避免长期工作在该偏置区。
- 频率响应：高频下电感呈现频率依赖性并最终被寄生电容限制（自谐振），具体 SRF 与 Q 值请参考厂商数据表。
- 温度影响：工作温度与封装热阻会影响额定电流和性能，设计时留有余量。
五、典型应用场景
- 通信与低频滤波：用于信号线的低通/带阻滤波、去耦与噪声抑制。
- 模拟与数字电路：作为 LC 滤波元件用于电源净化（需注意直流偏置）。
- 小功率点对点电源：可用于小电流的电源滤波，但若连续电流接近 Isat，需要谨慎评估。
六、PCB 布局与焊接建议
- 尽量缩短环路长度，靠近噪声源或供电端放置以提高滤波效果。
- 采取稳固焊盘、适当过孔散热（如有），并遵循厂家推荐的焊盘尺寸与回流曲线。
- 装配后避免在元件附近进行机械应力大的操作，防止裂纹或失效。
七、选型提示
在选型时，若电路工作电流长期接近或高于 130 mA，应重点评估电感在偏置下的剩余电感量；若需要更高的保有电感与较高的饱和电流，建议选择专为电源应用设计、标注更高 Isat/Irms 的功率电感。最终以厂家完整数据表为准，必要时进行样片测试以验证实际性能。
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