Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MLZ1005MR68WT000
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLZ1005MR68WT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLZ1005MR68WT000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.012g
- Inductor
- 680nH
- Electronic Component
- 1
- Electronic Component
- BM0058427634
- Current
- 450mA
- Frequency
- 210MHz
- Resistor(DCR)
- 300mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLZ1005MR68WT000 产品概述
一、产品概述
TDK MLZ1005MR68WT000 是一款0402封装的叠层贴片电感，标称电感值为680nH，公差±20%。该器件适用于对体积和高度有严格限制的表贴电路，提供功率滤波、去耦及射频阻抗控制等功能。凭借微小封装与相对较高的电感值，适合用于消费电子、便携设备以及射频前端的窄带滤波场合。
二、主要技术参数
- 电感值：680 nH（±20%）
- 饱和电流（Isat）：110 mA（典型值）
- 额定电流：450 mA（额定允许电流）
- 直流电阻（DCR）：300 mΩ
- 自谐振频率（SRF）：210 MHz
- 封装：0402（MLZ1005 尺寸系列）
- 类型：叠层电感（多层陶瓷结构）
三、产品特点
- 小型化：0402超小封装，便于高密度贴装与轻薄化设计。
- 高频性能：自谐振频率约210 MHz，适合在低于SRF的频段作为有效电感件使用。
- 低直流阻抗：300 mΩ 的DCR 在保证电感值的同时，减小直流损耗和发热。
- 可靠性：叠层陶瓷结构具有良好的热稳定性和机械强度，适合回流焊工艺。
四、典型应用
- 电源去耦与滤波（尤其空间受限的模块）
- 射频前端或IF滤波回路（在SRF以下工作）
- 模拟信号线的噪声抑制与共模/差模滤波（配合电容形成LC网络）
- 便携式设备、蓝牙/Wi‑Fi 模块、传感器前端等
五、选型与使用建议
- 工作频率：优选在自谐振频率210 MHz以下使用，接近SRF时电感值将显著下降并可能出现容性行为。
- 电流考量：饱和电流110 mA 表示在该直流偏流下电感值会开始下降；额定电流450 mA 为器件热和电气允许上限。设计时应根据电路直流偏流和允许的电感变化选择合适裕量。
- 损耗与发热：高直流电流或高频交流时，DCR 和铁损会导致发热，需评估温升与周围元件热耦合。
- 器件容差：±20% 精度适用于对精确电感值要求不高的通用滤波与去耦场合；若需更高精度，应考虑更严格公差或利用调谐电路补偿。
六、封装、安装与可靠性注意
- 0402 封装需采用精密贴装设备和合适焊膏印刷，推荐使用标准回流焊曲线（避免过高的峰值温度与长时间高温）。
- 贴片前确保PCB焊盘尺寸与制造商推荐一致，避免焊点不足或偏位。
- 储存与搬运时防止强烈振动与机械冲击，陶瓷叠层结构对弯曲和冲击较敏感。
- 在高湿或腐蚀环境中，可考虑封装或涂覆保护以延长可靠性。
七、典型电路参考与注意事项
- 与电容并联构成LC陷波或谐振电路时，请校验谐振频率与电路带宽，避免SRF引入非期望行为。
- 在差分或共模滤波使用时，注意布局对称与回流路径，尽量将电感与相关电容靠近噪声源或供电引脚放置。
- 对于功率或较大直流偏流场合，应通过仿真或原型测量验证电感饱和与温升性能。
如需器件原厂Datasheet、封装规格或回流焊推荐曲线，我可以帮助查找或解读具体参数与电路实例。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
