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TDK CGA2B2C0G1H100DT0Y0F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- TDK CGA2B2C0G1H100DT0Y0F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- CGA2B2C0G1H100DT0Y0F
- Electronic Component
- 1
- Electronic Component
- 10pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0230029506
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA2B2C0G1H100DT0Y0F 产品概述
一、产品简介
TDK 型号 CGA2B2C0G1H100DT0Y0F 为贴片多层陶瓷电容（MLCC），额定容值 10 pF，额定电压 50 V，温度系数 C0G（又称 NP0）。封装为 0402（约 1.0 mm × 0.5 mm），面向需要极高电气稳定性与低损耗的射频与精密模拟电路场合。
二、主要电气参数
- 容值：10 pF
- 额定电压：50 V
- 温度系数：C0G / NP0（典型温度稳定性，几乎无温漂）
- 介质特性：低介质损耗、高 Q 值、极小的电压系数（DC bias 影响可忽略）
三、主要特性与优势
- 温度与电压稳定：C0G/NP0 材料在–55°C 至 +125°C 范围内保持极低的容值漂移，适合精密时基与频率敏感电路。
- 低损耗、高 Q：适用于射频匹配、谐振回路与滤波器，信号衰减小。
- 小型化封装：0402 可实现高密度布板，适合移动和便携设备。
- 良好的长期可靠性：适用于对电容漂移和老化敏感的应用场景。
四、典型应用场景
- RF 调谐、天线匹配与阻抗匹配电路
- 振荡器与谐振回路（谐振/定频负载电容）
- 高频滤波器、耦合与去耦（小值耦合）
- 精密测量与参考网络（时基、采样电路）
五、封装与机械信息
- 封装：0402 表面贴装（建议参考具体尺寸表）
- 机械强度：0402 小尺寸在波峰/回流焊及板弯曲应力下易产生端接裂纹，需注意贴装与回流曲线控制。
六、布板与焊接建议
- 布局：将电容尽量靠近被滤波或匹配的器件引脚，缩短过孔与走线长度以降低寄生电感与寄生电阻。
- 焊接：遵循 TDK 推荐回流曲线，避免超温久烘。换锡或返修时避免重复高温循环。
- 处理：贴装时减少底部应力，避免在焊接后进行强力折弯或修板操作。
七、选型与注意事项
- 若系统对电压系数或温漂有严格要求，C0G/NP0 为首选；若需要更大容值或尺寸更小，可按工程需求在同系列中对比。
- 注意机械应力导致的裂纹风险，尤其在薄板或高振动环境中，必要时可考虑更大封装或保护结构。
- 生产与储存按湿敏等级（MSL）处理，防潮防尘，避免长期板面受污染影响焊接可靠性。
如需更详细的尺寸图、等效串联电阻 (ESR)、等效串联电感 (ESL) 或制造商的可靠性与回流曲线数据，可提供进一步信息以便查询 TDK 的技术资料。
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