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TDK C1005C0G2A101JT000F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- TDK C1005C0G2A101JT000F
- Type
- TDK
- Minimum package
- 10000
Technical parameters
- Electronic Component
- TDK
- Electronic Component
- C1005C0G2A101JT000F
- Electronic Component
- 1
- Electronic Component
- 100pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0257242311
- Electronic Component
- C0G
- Voltage
- 100V
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1005C0G2A101JT000F 产品概述
一、产品简介
TDK 型号 C1005C0G2A101JT000F 为贴片多层陶瓷电容（MLCC），标称容值 100 pF，容差 ±5%（J），额定电压 100 V，温度系数 C0G（亦称 NP0），封装为 0402（公制 C1005）。该器件定位为高稳定、低损耗的小容值精密陶瓷电容，适用于对温度和电压依赖性要求严格的电路场合。
二、主要特性
- 容值：100 pF；精度：±5%（J）
- 额定工作电压：100 V（适用于中高电压隔离/滤波场合）
- 温度系数：C0G/NP0，具有极低的温度漂移（典型约 ±30 ppm/°C），在宽温区间内保持高稳定性
- 介质特性：低介质损耗、低介质吸收、极佳的频率特性与高 Q 值
- 封装：0402 小型化，利于高密度 PCB 布局与轻量化设计
- 可靠性：陶瓷介质无极化，耐用性好，适合长期稳定工作
三、典型应用
- 高频电路与射频前端（振荡器、滤波器、阻抗匹配）
- 精密定时与计数电路（RC 振荡、相位锁定回路）
- ADC/DAC 的参考与去耦（对温度漂移和频率特性要求高的场合）
- 传感器前端与低噪声放大器输入端
- 航空航天、仪器仪表及工业控制等需要长期稳定性的应用
四、封装与 PCB 安装建议
- 0402 尺寸便于高密度布局，但对贴装与焊接工艺敏感，建议使用精确的贴片头与回流温度曲线，遵循制造商的回流焊规范。
- C0G 材料对直流偏置效应非常不敏感（比高介电常数材料稳定得多），在高电压场合仍能保持接近标称容量，适合要求容量稳定性的场景。
- 设计 PCB 时尽量缩短关键节点的回流路径，去耦电容应靠近电源引脚放置。0402 体积小，焊盘设计应避免过大热量集中导致焊点缺陷。
- 处理时注意防止机械应力（夹具或波峰焊不当可能导致裂纹），并采取防潮措施以免焊接时产生问题。
五、选型要点与替代建议
- 若设计对温度与频率稳定性要求高，C0G/NP0 是优先选择；若需要更大电容值或体积更小的成本导向方案，可考虑 X5R/X7R 等高介电常数材料，但需注意温度/偏置带来的容量变化。
- 在寻找替代元件时，可关注同等容值/电压/封装且为 C0G 的其它品牌（如 Murata、KEMET、Yageo）的对应型号，确保温漂、额定电压与尺寸一致。
- 采购时确认封装、端接（终端电镀）与包装形式（卷带）以匹配 SMT 线。
以上为 C1005C0G2A101JT000F 的概述与应用参考，具体电气特性（如自谐频率、介质损耗、绝缘电阻、寿命加速试验数据等）应以 TDK 最新数据手册与可靠性报告为准。
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