WMSIC Electronic Components

TDK C1005X7R1H103KT000F

ModelC1005X7R1H103KT000F
Package0402
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
TDK C1005X7R1H103KT000F
Type
TDK
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
C1005X7R1H103KT000F
Electronic Component
1
Electronic Component
10nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0258885985
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TDK C1005X7R1H103KT000F 片式陶瓷电容产品概述

一、产品定位与核心身份

TDK C1005X7R1H103KT000F是一款中高端通用型多层陶瓷电容(MLCC),属于TDK经典X7R系列,专为紧凑布局、宽温稳定的电子电路设计。其核心身份可概括为:0402封装(公制C1005)、10nF容值、±10%精度、50V额定电压、X7R温度系数,平衡了性能、成本与可靠性,覆盖消费电子、工业控制、汽车次级应用等多领域。

二、核心参数深度解析

该产品的关键参数需结合TDK专业命名规则与行业标准理解:

1. 容值与精度

  • 标称容值:10nF(命名中“103”代表10×10³pF=10nF);
  • 精度等级:±10%(命名中“K”为IEC精度代码,对应±10%);
  • 适用场景:满足大多数通用电路(如滤波、耦合)对容值偏差的要求,无需高精度场合的冗余成本。

2. 温度系数(X7R)

X7R是陶瓷电容的中温稳定型温度系数,定义为:

  • 工作温度范围:-55℃ ~ +125℃;
  • 容值变化率:≤±15%(TDK X7R典型表现为±10%以内,优于Y5V等通用材料);
  • 优势:适合环境温度波动大的场景(如户外设备、车载座舱),避免容值漂移导致电路性能下降。

3. 额定电压与绝缘特性

  • 直流额定电压:50V(命名中“1H”为TDK电压代码,对应50V DC);
  • 交流额定电压:约35V AC(直流电压的70%,行业通用换算);
  • 漏电流:典型值≤10nA(25℃、50V DC下),绝缘电阻≥10^9Ω,满足中低压电路的绝缘要求。

4. 封装标识

  • 封装代码:C1005(公制尺寸,对应英制0402);
  • 后缀说明:“T000F”为TDK内部包装/编带代码(通常为3000pcs/盘,适合自动化贴装)。

三、封装工艺与物理特性

该产品采用成熟的MLCC工艺,兼顾小型化与可靠性:

1. 尺寸与重量

  • 公制尺寸:长1.0±0.2mm × 宽0.5±0.2mm × 厚0.5±0.1mm;
  • 重量:约0.001g;
  • 优势:体积小、重量轻,适配智能手机、可穿戴设备等高密度PCB布局。

2. 工艺结构

  • 陶瓷介质:高介电常数X7R材料,多层堆叠提升容值密度;
  • 内电极:镍(Ni)基合金,兼容无铅工艺;
  • 外电极:镍/锡(Ni/Sn)镀层,耐焊接热冲击(260℃回流焊3次无异常)。

3. 包装方式

  • 标准包装:卷盘式编带(3000pcs/盘),符合IPC标准,支持高速贴装(≥10000pcs/h)。

四、关键性能优势

相比同封装、同容值的通用电容(如Y5V系列),该产品核心优势显著:

1. 宽温稳定性

X7R温度特性使容值在-55℃~+125℃内波动极小,避免了Y5V电容在高温下容值下降30%以上的问题,适合环境苛刻的工业/车载场景。

2. 高可靠性

TDK成熟的MLCC工艺确保:

  • 耐电压冲击:过压测试(1.5×额定电压,1s)无击穿;
  • 耐机械应力:PCB弯曲测试(10mm曲率,100次)无开裂;
  • 长期稳定性:125℃高温存储1000h后,容值变化≤±5%。

3. 成本效益平衡

比高精度NP0(C0G)电容成本低30%以上,比Y5V电容性能优(宽温、低漏电流),是“性能够用+成本可控”的最优选择。

五、典型应用场景

该产品覆盖多领域的通用与次级高性能需求:

1. 消费电子

  • 智能手机:PMU电源滤波、射频信号耦合;
  • 可穿戴设备:智能手环传感器电路、蓝牙模块滤波;
  • 智能家居:WiFi模块电源稳压、控制电路耦合。

2. 工业控制

  • PLC:输入输出电路EMI抑制、电机驱动滤波;
  • 工业传感器:温度/压力传感器信号调理。

3. 汽车电子(次级应用)

  • 车载信息娱乐系统:中控屏电源滤波、蓝牙模块耦合;
  • 车身控制模块(BCM):车窗/门锁控制电路滤波(非发动机舱高温场景)。

4. 物联网(IoT)

  • 低功耗节点:ZigBee模块电源滤波、传感器供电稳压。

六、可靠性与行业认证

TDK对该产品进行了严格的可靠性验证,并符合主流行业标准:

1. 可靠性测试

  • 高温存储:125℃×1000h,容值变化≤±5%;
  • 温度循环:-55℃~+125℃×1000次,无失效;
  • 湿度测试:85℃/85%RH×1000h,绝缘电阻≥10^8Ω。

2. 行业认证

  • 环保认证:RoHS(无铅)、REACH(有害物质限制);
  • 汽车认证:部分批次支持AEC-Q200(需确认具体料号后缀);
  • 焊接认证:符合J-STD-020回流焊标准。

七、选型与替代参考

1. 直接替代型号

  • 村田:GRM155R61H103KA73D(0402、X7R、10nF、50V、±10%);
  • 三星:CL05B103KA5NNNC(0402、X7R、10nF、50V、±10%)。

2. 升级/降级选项

  • 升级(更高精度):C1005X7R1H103JT000F(±5%精度);
  • 降级(更低成本):C1005Y5V1H103Z000F(±20%精度,Y5V介质);
  • 升压(更高电压):C1005X7R1J103KT000F(100V DC)。

该产品凭借宽温稳定、高可靠性、紧凑封装的核心优势,成为中低压通用电路的首选MLCC之一,适用于从消费电子到工业控制的多场景需求。

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