WMSIC Electronic Components

TDK MLG1005S27NJTD25

ModelMLG1005S27NJTD25
Package0402
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TDK MLG1005S27NJTD25
Type
TDK
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MLG1005S27NJTD25
Electronic Component
1
Package
0402
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±5%
Electronic Component
0.012g
Inductor
27nH
Electronic Component
1
Electronic Component
BM0264484649
Current
300mA
Resistor(DCR)
530mΩ
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TDK MLG1005S27NJTD25 高频功率电感产品概述

一、产品核心定位与基本属性

TDK MLG1005S27NJTD25是一款高频片式功率电感,属于TDK经典MLG系列,专为小型化、高频率、低功耗的无线通信电路设计。其核心参数匹配当前射频前端、可穿戴设备等高密度PCB布局需求,是替代传统电感的高性价比方案。

二、封装与物理尺寸特点

该电感采用0402(英制)/1005(公制) 封装,物理尺寸为:

  • 长度:1.0±0.2mm
  • 宽度:0.5±0.2mm
  • 高度:0.5±0.1mm

小体积优势显著:

  1. 适配智能手机、智能手表等轻薄设备的高密度PCB布局,可在有限空间内实现多电感并联/串联;
  2. 兼容主流SMT(表面贴装)生产线,焊接效率高,无额外安装空间要求。

三、电气性能关键指标解析

1. 电感值与精度

  • 标称电感值:27nH
  • 精度:±5%

该精度满足大多数射频电路的匹配需求(如蓝牙、Wi-Fi的阻抗匹配网络),避免因电感偏差导致信号反射或损耗增加。

2. 额定电流与功率损耗

  • 连续工作额定电流(Irms):300mA

  • 直流电阻(DCR):530mΩ

  • 低DCR优势:530mΩ是0402封装电感中的低阻水平,可减少直流功率损耗(P=I²·R),提升电池续航(尤其适合可穿戴、IoT终端);

  • 电流限制:实际工作电流建议不超过额定电流的80%(≤240mA),避免长期过载导致电感值漂移或饱和。

3. 高频特性

作为高频电感,其自谐振频率(SRF)≥10GHz(典型值),确保在射频频段(如2.4GHz、5GHz)内保持电感特性稳定——若工作频率接近SRF,电感会呈现容性,导致电路性能下降。

四、典型适用应用场景

1. 无线通信射频前端

  • 蓝牙5.0/5.1、Wi-Fi 6/6E模块的阻抗匹配网络、低通滤波电路;
  • 5G sub-6GHz频段的小型化射频子系统。

2. 可穿戴与便携式设备

  • 智能手表、手环的BLE(低功耗蓝牙)模块;
  • 无线耳机(TWS)的射频信号滤波。

3. 物联网(IoT)终端

  • LoRa、NB-IoT等低功耗广域网设备的天线匹配电路;
  • 智能家居传感器的无线通信模块。

4. 小型消费电子

  • 便携式音箱、游戏机的Wi-Fi连接模块;
  • 车载蓝牙适配器的射频前端。

五、选型与使用注意事项

1. 焊接工艺要求

  • 优先采用回流焊:峰值温度≤245℃,焊接时间≤10秒;
  • 手工焊需控制温度(≤350℃)和时间(≤3秒),避免损伤电感内部结构。

2. 存储与防护

  • 存储环境:常温(15-35℃)、干燥(相对湿度<60%),避免暴露于潮湿或腐蚀性气体;
  • 开封后建议1个月内使用,防止引脚氧化。

3. 电路设计注意

  • 确认工作频率低于自谐振频率(SRF),避免电感容性化;
  • 无极性设计:安装时无需区分引脚方向,简化PCB布局。

总结

TDK MLG1005S27NJTD25凭借小体积、高频率特性、低DCR、精准电感值,成为高密度射频电路设计的核心组件。其适配性覆盖从可穿戴到5G终端的多场景,是电子设备小型化、低功耗趋势下的优选电感方案。

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