Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MHQ1005P1N0BT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MHQ1005P1N0BT000
- Type
- SMD
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MHQ1005P1N0BT000
- Electronic Component
- 1
- Package
- SMD
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 1nH
- Electronic Component
- 1
- Electronic Component
- BM0058430285
- Current
- 1.2A
- Frequency
- 15GHz
- Resistor(DCR)
- 30mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MHQ1005P1N0BT000 产品概述
产品背景
随着电子元器件技术的迅速发展，市场对小型、高性能的电感组件的需求日益增长。MHQ1005P1N0BT000是一款由TDK公司推出的多层表面贴装电感，专为高频应用设计，特别适用于现代通信设备、射频（RF）模块和高速数字电路。凭借其优越的性能和广泛的应用范围，MHQ1005P1N0BT000成为了在复杂电路设计中的理想选择。
基本参数与特性
MHQ1005P1N0BT000采用高品质陶瓷材料作为磁芯，具备无磁性特性。这种材料选择不仅提升了电感的稳定性，还降低了在高频条件下的能量损耗。电感值为1nH，具有极低的容差（±0.1nH），适用于对精度有严格要求的应用场合。
电感的额定电流为1.2A，这使其能够在多数高频工作条件下可靠运行。针对低电阻的需求，MHQ1005P1N0BT000的DC电阻（DCR）最大值为30毫欧，表明在长时间工作时功耗极小，并有助于降低电路的整体热量。
该器件具有高达15GHz的自谐振频率，意味着它可以在高频信号下稳定工作，而不会引入显著的信号失真。这一特性使它特别适合用于无线通信、射频前端模块以及高频数字信号处理。
设计和安装
MHQ1005P1N0BT000的封装为0402（1005公制），尺寸为1.00mm x 0.60mm，厚度最大仅为0.60mm。这使得MHQ1005P1N0BT000具有非常小的占板面积，便于设计紧凑的电子设备。作为表面贴装型器件，其安装方便，特别适合于现代的表面贴装技术（SMT）生产线。
它的设计适应了极端工作环境，工作温度范围从-55°C 到 125°C，这使得该产品能够在严酷的环境条件下稳定工作，确保其在可靠性和耐用性方面的表现。
应用领域
MHQ1005P1N0BT000可广泛应用于多个领域，包括但不限于：
- 无线通信：在智能手机、平板电脑及其他无线通信设备中，用于滤波和信号处理。
- 射频设备：适用于高频射频放大器和混频器，确保信号质量和传输效率。
- 消费电子：在音频设备和高端音响系统中，帮助提升音效和信号清晰度。
- 汽车电子：应用于车载通信模块和自动驾驶系统，帮助提高信号的稳定性和降低延迟。
总结
MHQ1005P1N0BT000是TDK公司推出的一款高性能、多用途的表面贴装电感。其显著的低电感值、极低的DC电阻和高自谐振频率使其成为高频电路中理想的选择。在多个领域中，这款电感以其优越的设计表现和可靠性，满足了当下电子产品日益增长的高性能需求。此款电感的推出，再次证明了TDK在电子元器件领域的技术实力和市场影响力，是设计师们提升电路性能的理想方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
