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TDK MLG1005S3N6BT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S3N6BT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S3N6BT000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 3.6nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0265980204
- Current
- 700mA
- Frequency
- 5GHz
- Resistor(DCR)
- 90mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S3N6BT000 产品概述
一、产品简介
MLG1005S3N6BT000 是 TDK 提供的一款高频叠层片式无屏蔽电感，额定电感值 3.6 nH（0.0036 µH），封装为 0402（1005 公制）。该器件针对射频与高频电路优化，具有较低直流电阻与在百兆级频率下可接受的品质因数，适合体积受限且对频率响应有要求的移动通信与射频前端场合。
二、主要电气参数
- 电感值：3.6 nH（典型）
- 额定直流电流：700 mA
- 直流电阻（DCR）：约 90 mΩ
- 品质因数：Q = 8（@100 MHz）
- 自谐振频率（SRF）：约 5 GHz
- 类型：叠层无屏蔽多层陶瓷电感
- 封装：0402（1005）
三、频率特性与等效行为
在低于自谐振频率（≈5 GHz）范围内表现为感性元件，电感随频率上升会有寄生电容影响导致 L 降低并在接近 SRF 时出现谐振。Q 值在 100 MHz 附近约为 8，说明在百兆级用于匹配或小信号滤波时损耗可控；对于 GHz 级应用需参考器件的 S 参数 以准确评估相位和插损。
四、封装与安装建议
0402 小封装利于节省板面，但焊接与贴装要求高。推荐采用标准回流焊工艺，遵循厂商回流温度曲线并避免过多重复热应力。贴装时确保焊盘设计与制造商推荐一致，以获得良好焊接 fillet 与机械可靠性。
五、典型应用场景
- 射频匹配网络（手机、蓝牙、WLAN）
- 高频滤波器和谐振电路
- EMI/EMC 抑制与高速信号线阻抗调谐
- 偏置网络与阻隔电感（bias tees）
六、设计与工程注意事项
- DC 偏置与电流会引起电感下降，建议在长期应用中对额定电流做适当降额（例如 70–80%）；高脉冲电流需评估热升与可靠性。
- 器件为无屏蔽，邻近金属或走线会影响电感值与损耗，应避免近距离强耦合元件。
- 需要在目标频段测量实际器件的 S 参数 与 L/Q 曲线，设计时以实际测量数据为准。
- 封装小、寄生参数显著，PCB 布局中减少引线长度与避免不必要的过孔可降低寄生影响。
七、可靠性与测试建议
推荐在最终工艺条件下进行回流后电感、电阻及 S 参数测试以及温度循环试验。对关键射频路径，做带电老化与功率/电流应力测试以确认长期稳定性。
八、选型参考
若需要更高 Q 或屏蔽性能，可考虑较大封装或屏蔽型电感；若空间更受限则保持 0402 是合理平衡。最终选型应基于目标频段的实测 L、Q 与 SRF 数据，以及 PCB 布局和热/电流约束。
总结：MLG1005S3N6BT000 在 0402 体积下提供 3.6 nH 的高频性能，适合射频匹配与高频滤波应用；设计时应关注封装带来的寄生与 DC 偏置效应，结合实测参数优化电路表现。
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