Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK MMZ1005S102CTD25是一款0402封装单通道片式磁珠,专为高频电磁干扰(EMI)抑制设计,核心针对100MHz频段的噪声衰减需求,适配小型化、高密度PCB设计的电子设备,兼具低直流功耗与宽温可靠性。
该磁珠的关键参数明确了其应用边界与性能指标,具体如下:
高频噪声针对性强
100MHz是WiFi、蓝牙、NFC等无线通信的关键干扰频段,该磁珠在该频率下的1kΩ阻抗可有效衰减噪声,同时低频段(DC~几十MHz)阻抗低,不影响正常信号/电源传输,实现“通低频、阻高频”的精准滤波。
低功耗设计
750mΩ的直流电阻在同类0402磁珠中属于较低水平,当额定电流200mA工作时,直流功耗仅30mW(P=I²R=0.2²×0.75),可穿戴、IoT等低功耗设备无需担心额外发热与功耗负担。
宽温可靠性
-55℃~+125℃的工作温度范围,覆盖了工业现场(如户外传感器)、车载低温环境(如北方冬季)与高温工况(如充电设备内部),参数稳定性符合工业级标准。
小型化适配
0402封装体积仅1.0mm×0.5mm,可在PCB上实现高密度布局,满足智能手机、智能手表、微型传感器等小型设备的空间限制需求。
环保与合规
符合RoHS 2.0、REACH等环保指令,无铅、无镉等有害物质,适配全球市场准入要求。
该磁珠的性能与封装优势,使其广泛应用于以下领域:
TDK作为磁珠领域的领先品牌,该产品通过多项可靠性测试:
TDK MMZ1005S102CTD25是一款精准匹配100MHz频段EMI抑制需求的小型化片式磁珠,以低DCR、宽温范围、高可靠性为核心优势,适配消费电子、IoT、工业控制等多领域的小型化设备设计,是高密度PCB中实现电磁兼容(EMC)的理想元件。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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