WMSIC Electronic Components

TDK MAF1005GAD262AT000

ModelMAF1005GAD262AT000
Package0402
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MAF1005GAD262AT000
Type
TDK
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MAF1005GAD262AT000
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.011g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264870855
Operating Temperature
55℃~+125℃
Current
300mA
@Frequency
400Ω@100MHz
Resistor(DCR)
1.2Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TDK MAF1005GAD262AT000 片式磁珠产品概述

TDK MAF1005GAD262AT000是一款针对高频电磁干扰(EMI)抑制设计的0402封装片式磁珠,凭借超小型尺寸、宽温适应性及精准的阻抗特性,成为消费电子、工业控制等领域小型化设备的核心噪声抑制元件。

一、核心参数与性能特征

该磁珠的性能参数围绕EMI抑制效率、直流损耗、可靠性三大核心维度设计,关键指标如下:

  • 阻抗特性:在100MHz测试频率下阻抗为400Ω,误差范围±25%。磁珠的交流阻抗是抑制EMI的核心——该频率点覆盖蓝牙、WiFi等无线通信的常用干扰频段,400Ω的阻抗可有效衰减噪声信号,避免信号串扰或电磁泄漏。
  • 直流电阻(DCR):典型值1.2Ω,低DCR意味着300mA电流下直流压降仅0.36V,不会对电源效率或信号直流偏置造成明显影响,适配低功耗场景。
  • 电流与温度范围:连续工作电流额定值300mA,满足大部分低功耗芯片、传感器的供电需求;工作温度覆盖-55℃至+125℃,远超消费级元件常规上限,可稳定工作在工业、车载极端环境。
  • 封装尺寸:0402(公制1005)封装,尺寸仅1.0mm×0.5mm,贴装间距小,大幅节省PCB空间,适配智能手机、智能手表等便携设备的高密度设计。

二、典型应用场景

该磁珠的参数特性使其在多领域小型化设备中广泛落地:

  1. 消费电子:智能手机、智能手表的蓝牙/WiFi模块电源线路中,抑制100MHz左右干扰,提升无线连接稳定性;可穿戴设备传感器供电线路,避免噪声影响数据采集精度。
  2. 工业控制:小型工业传感器(温度、压力)、PLC模块的信号滤波电路,宽温范围适应车间温度波动,保障工业环境下的EMI抑制效果。
  3. 通信设备:小型无线路由器、物联网网关的射频前端及电源线路,过滤无线频段干扰,提升数据传输可靠性。
  4. 汽车电子(低功耗子系统):车载小型显示屏、胎压监测传感器供电线路,在-40℃低温启动及+85℃高温暴晒环境中稳定工作,抑制车内电磁干扰。

三、设计优势与应用要点

(注:此处为段落内容,小标题采用中文数字层级更清晰)

该磁珠兼顾性能与实用性,同时需注意以下应用细节:

  1. 核心优势:
    • 高密度贴装:0402封装支持0.5mm贴装间距,可在小面积PCB上集成更多元件,符合电子设备“小型化、轻量化”趋势;
    • 宽温可靠性:通过TDK严苛的温度循环测试,长期稳定工作在极端环境,减少售后故障风险;
    • 低损耗匹配:1.2Ω低DCR与300mA额定电流的组合,适配低功耗芯片供电,无需额外预留过大功率余量。
  2. 应用注意事项:
    • 电流匹配:连续工作电流不得超过300mA,峰值电流需参考TDK datasheet(一般为额定电流2-3倍,需结合工况确认);
    • 频率匹配:100MHz频段阻抗最优,若需抑制2.4GHz等其他频段噪声,需结合TDK阻抗曲线选择对应型号;
    • 焊接工艺:0402封装对焊接温度曲线要求高,需遵循TDK推荐参数(峰值温度245℃±5℃,时间≤10秒),避免虚焊影响性能。

四、品牌与可靠性保障

作为全球知名电子元件品牌,TDK对该磁珠的生产工艺与质量控制严格遵循IEC、JIS等国际标准,每批次通过阻抗测试、温度循环测试、焊接可靠性测试等多重验证,保障长期稳定工作。此外,TDK提供完整datasheet及技术支持,便于工程师进行EMI设计与参数匹配。

该产品凭借精准的性能参数与可靠的品牌背书,成为小型化电子设备EMI抑制的优选元件,可有效解决便携设备、工业模块等场景的噪声干扰问题。

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