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TDK MLG1005S3N9CT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S3N9CT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S3N9CT000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 3.9nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0058431441
- Current
- 700mA
- Frequency
- 5GHz
- Resistor(DCR)
- 110mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S3N9CT000 产品概述
一、产品简介
TDK 型号 MLG1005S3N9CT000 为 0402（1005公制）封装的叠层贴片电感，额定电感值 3.9 nH，直流电阻（DCR）约 110 mΩ，额定电流 700 mA，品质因数 Q = 8（@100 MHz），自谐振频率（SRF）约 5 GHz。该器件体积小、频率响应宽，适合高频信号处理与紧凑型电路板布局。
二、主要性能参数
- 电感值：3.9 nH
- 额定电流：700 mA
- 直流电阻（DCR）：110 mΩ
- 品质因数（Q）：8 @ 100 MHz
- 自谐振频率（SRF）：≈ 5 GHz
- 类型：叠层电感（Multilayer）
- 封装：0402（1005）
三、产品特性与优势
- 小尺寸：0402 封装适合空间受限设计，便于高密度贴装。
- 高频特性良好：SRF 约 5 GHz，适用于 GHz 级应用的阻抗匹配与滤波。
- 适中功率能力：700 mA 的额定电流可满足移动设备和射频前端中常见的直流偏置需求。
- 稳定性：叠层结构在温度与机械应力下表现出较好的稳定性，适合常规表面贴装工艺。
四、典型应用场景
- 射频匹配网络与谐振回路（前端滤波、天线调谐）。
- 高频滤波器与去耦网络（用于抑制射频干扰）。
- 无线通信模块、蓝牙/Wi‑Fi 射频链路的阻抗整形。
- 高速数字接口中的串扰控制与共模抑制（视具体拓扑而定）。
五、选型与使用注意事项
- 频率匹配：在使用时应根据工作频段选择电感值与 Q 值，接近 SRF 时电感值会降低且行为趋向电容性。
- DCR 与插入损耗：110 mΩ 的 DCR 在直流偏置与低频损耗上较小，但在高频下需关注 Q 对带宽与损耗的影响。
- 电流裕度：额定 700 mA 为持续工作值，设计时应考虑温升和可能的瞬态电流，适当留有裕量。
- 布局建议：贴装时短引线、良好地平面与旁路电容配合可优化性能，避免在高振幅节点产生寄生耦合。
六、封装与可靠性
0402 小封装对贴装工艺敏感，推荐使用与芯片同等精度的回流焊工艺和合适的阻焊/焊盘设计，以降低热应力与机械损伤风险。TDK 产品通常经过出厂电性能筛选与常规可靠性试验（如温度循环、振动与焊接适应性测试），建议在项目中进行自定义的可靠性评估以满足最终应用要求。
七、推荐替代与组合使用建议
在需要更高 Q 或更低 DCR 的场合，可考虑同系列或其他厂商的高 Q 型号；若需要更高额定电流，则选择尺寸更大或专为电源应用设计的电感。与射频网络设计配合时，常与微带线、耦合电容或可调电容一同仿真优化。
总结：MLG1005S3N9CT000 以其微小体积和良好的高频响应，适合移动终端与射频前端中对空间和频带要求严格的场合。选型时请结合实际工作频段、功率要求及PCB布局做综合评估并进行原型验证。
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