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TDK MHQ1005P8N2GT000
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MHQ1005P8N2GT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MHQ1005P8N2GT000
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Inductor
- Electronic Component
- ±2%
- Electronic Component
- 0.012g
- Inductor
- 8.2nH
- Electronic Component
- 1
- Factor
- 23@250MHz
- Electronic Component
- BM0058431007
- Current
- 550mA
- Frequency
- 3.6GHz
- Resistor(DCR)
- 120mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MHQ1005P8N2GT000 产品概述
一、产品简介
MHQ1005P8N2GT000 为 TDK 系列 0402（1005公制）贴片电感，标称电感值 8.2 nH，公差 ±2%，额定直流电流 550 mA，直流电阻（DCR）约 120 mΩ，品质因数 Q = 23（@250 MHz），自谐振频率（SRF）约 3.6 GHz。小尺寸与高自谐频率使其适合高频电路和空间受限的表面贴装应用。
二、主要特性
- 极小封装（0402）便于高密度 PCB 设计；
- 高精度 ±2%，利于频率匹配与滤波器一致性；
- 中等电流承载（550 mA），适用于射频偏置、共模/差模小功率环节；
- 较低 DCR（120 mΩ）有助于降低能量损耗与温升；
- SRF 3.6 GHz，适用于射频前端及高频滤波应用。
三、典型应用
- 手机、无线模块的射频匹配网络与滤波；
- 蓝牙、Wi‑Fi、GNSS 等短距离通信的阻抗调节与反馈网络；
- 高频去耦与 EMI 抑制；
- 高频放大器的偏置与旁路线路。
四、选型注意事项
- 工作频率应远低于 SRF（3.6 GHz），否则电感行为会退化为电容性；
- 考虑额定电流与实际工况电流（含脉冲），避免长期过流造成电感值漂移或热失效；
- 若对损耗敏感，可在同尺寸中比较 Q 值与 DCR 的权衡；
- 对温度系数、有源件邻近热源的场合，检查随温度的电感变化与可靠性数据。
五、PCB 与工艺建议
- 采用厂家推荐的焊盘尺寸与过孔布局，确保焊点完整与热散布；
- 最小化寄生电容与不必要的环路面积，以维持高 Q 与预期 SRF；
- 贴装时遵循回流温度曲线，避免过热导致封装应力或电性能退化；
- 对于关键射频路径，可在布局后做实际网络分析仪测量验证。
六、测试与质量验证
- 在目标频段使用阻抗分析仪或矢量网络分析仪测量 L、Q 与 SRF；
- 进行电流导通（直流）与温升测试，确认在额定电流下的稳态温度；
- 参考 TDK 提供的可靠性试验与封装机械强度规范（如焊接热循环、振动测试）。
结论：MHQ1005P8N2GT000 在 0402 封装中以较高精度、较低 DCR 和较高 SRF 提供可靠的高频电感解决方案，适用于空间受限且对频率和匹配有较高要求的移动与无线应用。在最终设计中应结合工作频率、实际电流及 PCB 布局进行验证与选型。
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