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TDK MHQ1005P4N7BTD25
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MHQ1005P4N7BTD25
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MHQ1005P4N7BTD25
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 4.7nH
- Electronic Component
- 1
- Factor
- 23@250MHz
- Electronic Component
- BM0262575486
- Electronic Component
- AEC-Q200
- Current
- 800mA
- Frequency
- 5GHz
- Resistor(DCR)
- 80mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MHQ1005P4N7BTD25 产品概述
一、产品简介
MHQ1005P4N7BTD25 是 TDK 推出的超小型贴片电感（0402 / 1005 米制），标称电感值 4.7 nH，针对高频应用与车规级电子设备设计。器件尺寸小、封装密度高，适合空间受限且对射频性能有要求的系统。
二、主要参数
- 电感值：4.7 nH
- 额定电流：800 mA（最大持续通过电流）
- 直流电阻（DCR）：80 mΩ
- 品质因数（Q）：23 @ 250 MHz
- 自谐振频率（SRF）：约 5 GHz
- 车规等级：AEC-Q200 认证
- 封装：SMD 0402（1005）
三、性能特点
- 高频性能良好：Q 值 23@250MHz、SRF ~5GHz，可用于 2.4GHz/5GHz 以及更高频段的射频电路。
- 低量级直流阻抗：80 mΩ 在微小尺寸下维持合理 DCR，兼顾损耗与功率处理能力。
- 较高额定电流：800 mA，适合微电流偏置网络及部分电源路径。
- 车规可靠性：通过 AEC-Q200，适配汽车级环境与寿命要求。
四、典型应用
- 射频匹配网络、滤波与阻抗变换
- 无线通信前端（Wi‑Fi、蓝牙、LTE 等）
- EMI 抑制与共模/差模滤波（配合其他元件）
- 汽车电子：信息娱乐、无线模块、传感器信号链
五、布局与焊接建议
- 推荐采用与厂商给定的 PCB 焊盘尺寸匹配的布局以保证焊接可靠性与电气性能。
- 焊接工艺应遵循无铅回流曲线，避免过高温度或过长保温时间造成内部结构损伤。
- 在高频应用中，尽量将电感与相关器件（电容、射频器件）缩短连线，以减少寄生电感与走线损耗。
- 避免在元件下方打孔或有过多热膨胀差异，降低机械应力导致失效风险。
六、可靠性与注意事项
- 在接近或超过额定电流时，电感可能因饱和或温升导致感值下降与 DCR 增大，实际设计应留有裕量。
- 车规等级保证了在严苛温度与振动条件下的可靠性，但仍建议进行系统级验证（温度循环、湿热、振动等）。
- 高频测量时使用合适的校正与夹具，以获得准确的 L、Q 与 SRF 数据。
七、封装与订购信息
- 品牌：TDK
- 封装形式：SMD 0402（1005）
- 型号：MHQ1005P4N7BTD25（用于物料管理与采购时请核对完整型号与包装批次）
八、存储与处理
- 建议按干燥箱包装与厂商推荐的保质期、湿度等级（MSL）要求进行存储与回流前的预烘烤。
- 操作时避免强机械冲击与弯曲，应使用合适的取放工具防止破损。
总结：MHQ1005P4N7BTD25 以其小尺寸、良好高频特性与车规级可靠性，适合空间受限的射频与汽车电子应用。在实际项目中，请结合电流裕量、热管理与 PCB 布局优化以确保长期稳定工作。若需更详细的电气模型、回流曲线或封装图，请参考 TDK 官方规格书。
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