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TDK MLG0603P3N9BTZ10
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLG0603P3N9BTZ10
- Type
- TDK
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG0603P3N9BTZ10
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.009g
- Inductor
- 3.9nH
- Electronic Component
- 1
- Factor
- 14@500MHz
- Electronic Component
- BM0258781219
- Current
- 400mA
- Frequency
- 7.1GHz
- Resistor(DCR)
- 220mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG0603P3N9BTZ10 产品概述
一、主要参数与性能亮点
MLG0603P3N9BTZ10 为 TDK 小型贴片电感，典型电气参数如下：电感值 3.9 nH，额定直流电流 400 mA，直流电阻 DCR 220 mΩ，品质因数 Q = 14（@500 MHz），自谐振频率 SRF = 7.1 GHz；封装为超小型 0201 表面贴装。该器件以小封装实现 GHz 级别的自谐振频率与中等 Q 值，适合高密度、高频应用场合。
二、典型应用场景
适用于移动终端射频前端、天线匹配网络、带通/带阻滤波器、RF 匹配元件、VCO 与振荡电路以及各类无线模块（Wi‑Fi、蓝牙、GPS 等）。因电感值较小且 SRF 较高，尤适合数百 MHz 至 GHz 级的阻抗匹配与微带线调谐场合。
三、设计与布局建议
为发挥器件高频性能，应保持器件与相连器件之间的走线尽量短、粗并减少走线环路面积；避免在电感下方放置敏感信号线或大面积接地平面导致寄生电容变化；若用于串联匹配，尽量靠近射频源或负载贴装，减少过多过孔和不必要的过渡。DCR 为 220 mΩ，满载 400 mA 时产生约 35 mW 的热耗散，通常不会引起明显发热，但在连续大电流或高密度布局时需留意热叠加并适当留有裕量。
四、频率特性与注意事项
Q = 14（@500 MHz）表明在中高频段具有中等损耗性能；SRF = 7.1 GHz 意味着在该频率附近电感的等效电感值开始下降并最终呈现电容性行为。因此在设计时应避免器件工作在接近或超过 SRF 的区间，必要时通过仿真（S 参数）验证实际频响特性与匹配效果。
五、工艺与可靠性要点
该型号适配常规无铅回流焊工艺，但建议严格按照 TDK 规格书的回流曲线与潮湿敏感等级（MSL）要求进行生产与储存。贴装时注意避免机械应力与跌落导致的陶瓷裂纹，取放与焊接过程中采取防静电与防潮措施。最终性能与选型应以厂家最新数据手册为准，并建议在样片 PCB 上进行实测验证（如 L、Q、S11/S21 测量）。
如需进一步的封装尺寸、推荐焊盘、温度循环与可靠性数据，请参考 TDK 官方数据手册或联系供应商获取完整技术支持。
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