WMSIC Electronic Components

TDK MLP1608V1R0BT0S1

ModelMLP1608V1R0BT0S1
Package0603
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MLP1608V1R0BT0S1
Type
TDK
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MLP1608V1R0BT0S1
Electronic Component
1
Package
0603
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
±20%
Electronic Component
0.033g
Inductor
1uH
Electronic Component
1
Electronic Component
BM0254006304
Current
700mA
Resistor(DCR)
300mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MLP1608V1R0BT0S1 — 0603贴片叠层电感产品概述

一、产品简介

MLP1608V1R0BT0S1 为 TDK 系列0603(公制1608)叠层片式电感,标称电感值 1.0 µH,公差 ±20%。该器件针对空间受限的表贴应用设计,适合中低电流、去耦与 EMI 抑制场合。典型直流电阻(DCR)约为 300 mΩ,额定直流电流 700 mA(在额定条件下长期可靠工作),外形小巧,适合高密度PCB布板。

二、主要参数(核心规格)

  • 品牌:TDK
  • 型号:MLP1608V1R0BT0S1
  • 封装:0603(1608公制)贴片
  • 电感值:1.0 µH ±20%
  • 额定电流:700 mA
  • 直流电阻(DCR):约 300 mΩ
  • 类型:叠层(多层)片式电感

三、性能特点与优缺点

  • 优点:体积小、贴片化、适配自动化装配;适用于去耦、滤波和电源线的干扰抑制;叠层结构在尺寸受限时能提供较高电感密度。
  • 需注意:相对较高的 DCR 导致在较大电流下存在较大功耗与发热;1µH ±20%为通用等级,精密滤波需要考虑电感公差与频率响应;直流偏置条件下电感值会降低,应依据实际电流进行验证。

四、典型应用

  • 开关电源输入/输出滤波与去耦
  • 电源轨 EMI 抑制与共模/差模网络(配合电容)
  • 低频信号滤波与噪声减小
  • 移动设备、消费电子、小型模块电源匹配

五、选型与布局建议

  • 在靠近噪声源(例如稳压器、开关管)处放置,缩短走线以减少寄生电感与阻抗。
  • 对于接近额定电流工作点的应用,留足安全裕度并评估温升;必要时采用并联或选择低DCR型号以降低功耗。
  • 注意电感受直流偏置影响,建议在目标电流条件下测量实际 L 值与损耗。
  • 焊接采用标准 SMT 回流工艺,遵循器件与板材的热可靠性要求,避免过度机械应力。

六、可靠性与包装

  • 叠层片感在常规温湿度与回流工艺下表现稳定,但长期高温高流条件会加速电阻与性能衰减,需要进行功率与热管理验证。
  • 常见为卷带(Tape & Reel)等适配自动贴装的包装方式。订购时请与供应商确认库存、包装数量与可追溯批号。

如需更详细的频率响应曲线、温漂与饱和特性、回流焊详细曲线或替代型号建议,可提供目标应用场景与工作条件,我将基于具体工况给出更精确的选型与验证建议。

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