WMSIC Electronic Components

TDK MDF1005GAD102ATD25

ModelMDF1005GAD102ATD25
Package0402
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MDF1005GAD102ATD25
Type
TDK
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MDF1005GAD102ATD25
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.031g
Electronic Component
1
Channel Count
1
Electronic Component
BM0262570887
Operating Temperature
55℃~+125℃
Current
550mA
@Frequency
1kΩ@900MHz
Resistor(DCR)
690mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MDF1005GAD102ATD25 — TDK 0402 封装磁珠产品概述

一、产品简介

MDF1005GAD102ATD25 是 TDK 推出的 0402(1005 公制)封装磁珠,针对高频 EMI 抑制优化。标称阻抗 1 kΩ @ 900 MHz,直流电阻(DCR)约 690 mΩ(±25%),额定直流电流 550 mA,单通道设计,工作温度范围 -55℃ 至 +125℃。器件体积小、适合空间受限的移动与无线终端、物联网和消费类电子应用。

二、主要电气参数

  • 阻抗:1 kΩ @ 900 MHz(用于射频/无线频段的传导噪声抑制)
  • DCR:690 mΩ,容差 ±25%(影响通断损耗和功耗)
  • 额定电流:550 mA(持续通过电流能力)
  • 通道数:1(单一信号/电源线滤波)
  • 温度范围:-55℃ 至 +125℃(适应工业级环境)

三、产品特性与优势

  • 高阻抗在 900 MHz 附近提供优异的射频噪声抑制,适合 GSM/900 及附近频段抑扰。
  • 0402 小尺寸利于高密度 PCB 布局,适合移动终端与紧凑型模组。
  • 低直流电阻降低功率损耗,兼顾信号完整性与 EMI 抑制。
  • 宽工作温度与工业级耐受性,适用于多种环境工况。

四、典型应用场景

  • 蜂窝与无线通信设备(GSM、物联网模组)
  • 手机、平板与可穿戴设备的射频/电源噪声抑制
  • 摄像头模组、蓝牙/Wi‑Fi 前端滤波
  • 工业控制与汽车电子(需注意额定电流与热设计)

五、布局与使用建议

  • 将磁珠置于噪声源与受扰电路之间,靠近噪声源一侧布放以提高抑制效率。
  • 对于电源线滤波,建议与旁路电容配合使用,形成宽频段衰减。
  • 当电流接近额定值时,应评估自热与阻抗随温升的变化,必要时选用并联或更大封装器件。
  • 采用推荐的回流焊工艺,遵循 TDK 的焊接曲线与抗热循环要求以避免可靠性问题。

六、可靠性与采购信息

  • 封装:0402(1005 公制),便于自动贴装与批量生产。
  • 建议在选型阶段获取 TDK 原厂数据手册以查看全频率阻抗曲线、功率与温升曲线及机械可靠性测试结果。
  • 订购时注意器件完整型号(MDF1005GAD102ATD25)与包装单位,以确保与 BOM 一致。

七、选型注意事项

  • 核查实际工作频带与器件阻抗曲线,避免在器件谐振点附近造成意外响应。
  • 若电流裕度不足,考虑并联多只或选用更高额定电流的磁珠/电感器件。
  • 高频应用同时要关注器件寄生电容对信号的影响,必要时进行电磁仿真验证。

如需完整数据手册(频率响应曲线、温升与机械规格等)或在具体电路中的仿真与布局支持,可提供 PCB 片段与工作频段,我可协助进行更精确的选型与验证建议。

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