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TDK MLG1005S15NHT000
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S15NHT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S15NHT000
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.012g
- Inductor
- 15nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0058427607
- Current
- 400mA
- Frequency
- 2.2GHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S15NHT000 产品概述
一、产品简介
TDK MLG1005S15NHT000 是一款 0402（1005）封装的叠层陶瓷片式电感，标称电感值 15 nH，公差 ±3%。该器件面向高密度 SMD 设计，适用于射频/高频与一般去耦、阻抗匹配与滤波场合。
二、主要电气参数（典型）
- 电感值：15 nH ±3%
- 额定电流：400 mA（连续）
- 直流电阻（DCR）：典型约 350 mΩ（文档中亦有 550 mΩ 的记录，请以厂商数据手册为准）
- 品质因数：Q ≈ 8（@100 MHz）
- 自谐振频率（SRF）：约 2.2–2.8 GHz（器件进入自谐振后电感性下降）
- 封装：0402（MLG1005 系列）
- 类型：叠层电感（陶瓷）
三、性能特点与应用场景
- 小尺寸、高密度封装，适合空间受限的移动通信、射频模块和消费电子设备。
- 中等 Q 值（在 100 MHz 附近）适合宽带匹配、阻抗调整与 EMI 抑制。
- SRF 在 GHz 级别，适用于低 GHz 频段的射频回路，但在接近或超过 SRF 时应选用其他结构或调整网络。
- 常见应用：RF 匹配网络、输入/输出阻抗调节、带通/带阻滤波、共模/差模滤波（视拓扑而定）、电源去耦与噪声抑制。
四、设计与使用建议
- 自谐振频率（SRF）以上电感效应将明显下降，设计时应保证工作频率低于 SRF 的安全余量（通常留 20–30% 余量）。
- DC 偏置会导致实测电感下降，建议在目标工作电流下验证电感值并考虑裕量。
- 额定电流为 400 mA，连续工作时应考虑温升与焊接工艺带来的热影响，必要时进行电流去评级（例如取额定的 70–80%）。
- 布局上尽量缩短与相连走线，减小寄生电容和走线电感；在射频应用中注意地平面和参考回路的完整性。
五、封装与可靠性提示
- 0402 小尺寸对贴装与回流焊工艺敏感，建议使用可控回流曲线并避免过度机械应力。
- 在选型和批量采买前，参照 TDK 的正式数据手册获取完整的频率响应、温度特性与可靠性测试数据，必要时索取样片并进行实际测量验证。
六、选型要点
- 若工作频率接近或高于 2.2 GHz，应考虑 SRF 更高或具有更好高频特性的器件。
- 对于要求更低 DCR 或更高 Q 的应用，可在同尺寸或更大封装中比较其他型号以满足损耗和带宽要求。
如需，我可以帮你查找并比对 TDK 官方数据手册中的详细参数表与频率响应曲线，或推荐同一系列替代器件以满足不同频段与功率需求。
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