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TDK C0603X5R1C104KT00NE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- TDK C0603X5R1C104KT00NE
- Type
- 0201
- Minimum package
- 15000
Technical parameters
- Electronic Component
- TDK
- Electronic Component
- C0603X5R1C104KT00NE
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0230642250
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C0603X5R1C104KT00NE 产品概述
一、主要参数
型号：C0603X5R1C104KT00NE（TDK）
类别：多层陶瓷贴片电容（MLCC）
容量：100 nF（0.1 μF）
容差：±10%
额定电压：16 V DC
介质材料/温度系数：X5R（适用温度范围 -55°C 至 +85°C，温度引起的容量变化在规定范围内）
封装：0603（1608公制）——注意型号命名中为0603，请在物料确认时以厂商数据表为准
二、产品特点
- 体积小、容量密度高：0603尺寸适合空间受限的高密度贴片设计。
- X5R介质：相较于NP0/C0G，X5R在体积与容量上具有更高的比能量，适合去耦和旁路用途；但属于Ⅱ类介质，温度与直流偏置下容量会有一定变化，应在电路设计中予以考虑。
- 低等效串联阻抗（ESR）与低等效串联电感（ESL），有利于高频去耦与滤波。
- 适配自动化贴装与回流焊工艺，良好的工艺兼容性。
三、典型应用场景
- 电源总线去耦、IC近端去耦（处理器、ADC/DAC、电源管理芯片等）
- 通信设备、移动终端、消费电子、汽车电子（非关键安全回路时根据资格要求确认）中的滤波与旁路
- 高频信号路径的去耦与滤波网络
四、可靠性与使用注意
- 直流偏置效应：施加额定电压时容量会下降，尤其对高电压与小尺寸高容量电容影响明显，建议在关键设计中做实测评估并留足裕量。
- 温度影响：X5R在低温或高温边界会有容量偏移，须按工作温区评估。
- 机械应力敏感：贴片电容对焊接应力与基板弯曲较敏感，需优化焊盘设计与回流曲线，避免倾角或过大焊料体积导致裂纹。
- 储存与搬运：避免潮湿、高温、强震动；贴片在回流前可按厂商建议进行烘烤防潮。
五、封装与安装建议
- 推荐按TDK提供的封装尺寸与焊盘推荐图设计PCB焊盘，保证良好焊接强度与可靠性。
- 回流焊工艺需遵循通用无铅回流温度曲线，并避免重复高温循环。
- 对于关键可靠性场合，建议进行热循环、湿热与机械应力测试验证。
六、选型与替代方案
- 若需更稳定温漂可选NP0/C0G系列；若需更高电压或更小尺寸可参考同家或其他厂商的相近规格（Murata、KEMET、Samsung等均有对应容量与封装的MLCC）。
- 选型时关注直流偏置、电压与温度下的实际有效容量以及封装可焊性与可靠性要求。
七、采购与标识
- 型号中T00NE通常对应TDK的包装/代码版本，具体包装卷装、箱量与可用性请以TDK最新目录或代理商报价为准。
- 采购时建议索取并核对厂商数据手册、耐久性与认证资料，确保满足目标应用的环境与可靠性需求。
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