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TDK MLG1005S15NJT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S15NJT000
- Type
- 0402
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S15NJT000
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Inductor
- 15nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0255087591
- Current
- 400mA
- Frequency
- 2.2GHz
- Resistor(DCR)
- 350mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S15NJT000 产品概述
一、主要规格
- 型号：MLG1005S15NJT000（TDK）
- 封装：0402（公制1005）贴片
- 电感值：15 nH ±5%
- 额定电流：400 mA
- 直流电阻（DCR）：350 mΩ
- 品质因数（Q）：8 @ 100 MHz
- 自谐振频率（SRF）：2.2 GHz
二、特性与性能解读
该器件为超小型高频贴片电感，15 nH 属于中低电感量级，适用于射频/高频回路。Q 值 8（100 MHz）表明在中高频段具有中等选择性；SRF=2.2 GHz 意味着在此频率附近电感开始转为容性作用，应避免在高于 SRF 的工作点直接当感性元件使用。DCR 较高（350 mΩ），对直流通流损耗和低频插损有显著影响；按 I^2·R 计算，在满流 400 mA 下器件功耗约 0.4^2×0.35 ≈ 0.056 W（56 mW），需注意温升和热稳定性。
三、典型应用场景
- 射频匹配网络中的小量级电感元件（低介入量）
- 高频滤波器、共模/差模滤波设计的串联电感
- 天线阻抗调谐、RF 前端滤波或负载匹配
- 数字高速链路的去耦与阻抗控制（在合适频段内）
四、选型与注意事项
- 若系统对插入损耗或发热敏感，应考虑更大封装或低 DCR 型号；0402 封装受限于电流和热耗。
- 电感随直流偏置电流会下降（电感退磁），在高直流偏置场景需查验直流偏流特性曲线。
- 使用环境温度上升会影响 DCR 和功耗能力，应按系统最高温度进行额定电流/温升评估与降额设计。
- SRF 限制高频应用，若工作频率接近或超过 2.2 GHz，应改用 SRF 更高或专用射频电感。
五、PCB 布局与焊接建议
- 采用短且宽的走线连接电感以降低寄生电感与串联电阻。
- 0402 焊盘按照制造商焊接流片建议设计，控制焊膏量，避免冷焊或焊桥。
- 回流焊温度曲线应符合 TDK 推荐的峰值与升温速率，避免过高热应力影响电感性能与可靠性。
- 对于高频路径，尽量靠近器件放置减少走线长度，必要时做接地平面屏蔽。
六、测试与可靠性验证
- 使用网络分析仪测量阻抗/相位随频率变化，验证 SRF 与实际阻抗曲线。
- 用精密 LCR 表在多个频点测量电感与 Q 值；在不同直流偏置下复测以评估电感衰减。
- 完成温升测试与循环回流焊可靠性测试，验证在实际工艺与环境下的稳定性。
总结：MLG1005S15NJT000 以其超小型封装和中高频特性适合空间受限的射频与滤波应用，但需关注较高的 DCR 和 SRF 限制，在选型与布局时应综合考虑功耗、温升与频率工作区间。
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