WMSIC Electronic Components

TDK MMZ0603S102HT000

ModelMMZ0603S102HT000
Package0201
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MMZ0603S102HT000
Type
TDK
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MMZ0603S102HT000
Electronic Component
1
Package
0201
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.009g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264212678
Operating Temperature
55℃~+125℃
Current
200mA
@Frequency
1kΩ@100MHz
Resistor(DCR)
1.25Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMZ0603S102HT000 产品概述

一、产品简介

MMZ0603S102HT000 是 TDK 推出的单通道磁珠(Ferrite Bead),型号常用作高速信号或电源线的 EMI 抑制元件。标准描述为 FERRITE BEAD 1 KOHM 0201 1LN,主要特点为在 100 MHz 时具有约 1 kΩ 的阻抗,适用于体积受限的贴片布置与高频干扰抑制。

二、主要性能参数

  • 直流电阻 (DCR):1.25 Ω
  • 阻抗:1 kΩ @ 100 MHz(典型值)
  • 额定电流:200 mA
  • 通道数:1(单端)
  • 误差(阻抗容差):±25%
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 封装:0201(即 0.6 mm × 0.3 mm,常称 0603 公制)
    这些参数表明该磁珠在高频段有很强的抑制能力,但直流电阻相对较高,应注意在大电流或低压差应用时的压降与发热。

三、封装与机械特性

0201 超小型封装适合空间受限的移动设备、可穿戴和微型模块。建议在焊接与贴装时使用高精度贴片机和细焊膏印刷,按厂商建议的无铅回流曲线操作(峰值温度通常 ≤ 260 ℃),以保证焊接可靠性与机械强度。

四、典型应用

  • 手机、平板与可穿戴设备的电源线噪声滤除
  • 无线通信模块、RF 前端的共模/差模干扰抑制(单通道用于单端线路)
  • IoT、蓝牙、Wi‑Fi 等短距离无线设备中,靠近敏感器件的高频抗干扰
  • 信号线旁路与板级 EMI 控制,尤其是在 100 MHz 左右的噪声带

五、选型与布局建议

  • 电流与压降:在额定 200 mA 条件下,DCR=1.25 Ω 会产生约 0.25 V 的压降(V = I·R),功率损耗约 50 mW(P = I^2·R)。若电路对压降敏感或工作电流高于 200 mA,应选用 DCR 更低或额定电流更高的型号。
  • 阻抗与带宽:该型号在 100 MHz 处阻抗高,适合抑制该频段及其附近谐波;对更宽频带需求时可并联或组合其他频率特性的元件。
  • 布局:尽量将磁珠靠近噪声源(如芯片电源引脚)或靠近接收端放置,走线尽量短且过孔少,配合旁路电容形成低阻抗回路。
  • 焊盘与回流:遵循 TDK 推荐焊盘尺寸,避免过大焊盘导致应力集中或焊点缺陷;回流后进行视觉与电气检查。

六、可靠性与储存

  • 工作温度覆盖 -55 ℃ 到 +125 ℃,适应多数工业级与消费级环境。
  • 储存时避免高湿、高温、及长时间暴露于腐蚀性气体;贴片卷须保持防潮包装,必要时回流前进行烘烤除湿。
  • 清洗:若使用清洗工艺,确认清洗剂对磁珠材料无腐蚀性影响。

七、总结

MMZ0603S102HT000 是一款面向高频 EMI 抑制、体积极小的单通道磁珠,100 MHz 处约 1 kΩ 的阻抗使其在移动通信与射频模块中表现良好。但需要在选型时兼顾其较高的直流电阻与限流能力,评估压降与功耗对电源完整性的影响。合理的 PCB 布局与焊接工艺能最大化其抑制效果并保证长期可靠性。若需更高电流或更低 DCR 的方案,可咨询替代型号或并联配置的可行性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.