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TDK MLZ2012M4R7WT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLZ2012M4R7WT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLZ2012M4R7WT000
- Electronic Component
- 1
- Package
- 0805
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.042g
- Inductor
- 4.7uH
- Electronic Component
- 1
- Electronic Component
- BM0227377083
- Current
- 500mA
- Frequency
- 2MHz
- Resistor(DCR)
- 300mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLZ2012M4R7WT000 产品概述
一、产品简介
MLZ2012M4R7WT000 是 TDK 推出的叠层铁氧体贴片电感，封装规格为 0805（MLZ/2012M 对应 0805 尺寸）。器件标称电感值为 4.7 μH，公差 ±20%，面向空间受限的 SMD 电路板设计，适合用于滤波、能量传递与去耦等场合。
二、主要参数
- 电感值：4.7 μH（±20%）
- 额定电流：500 mA（连续通过而不致温升或退磁的参考值）
- 饱和电流（Isat）：180 mA（在规定降容范围内的饱和指标）
- 直流电阻（DCR）：典型约 300–390 mΩ（视批次与测试条件略有差异）
- 自谐振频率（SRF）：约 2 MHz
- 类型：叠层（多层）铁氧体芯片电感（SMD）
- 封装：0805（2012 公制）
三、特性与优势
- 小型化封装，适合高密度 PCB 布局，减小占板面积。
- 叠层结构提供较高的电感密度，利于在有限体积内实现较大电感值。
- 铁氧体材料对中低频噪声有良好抑制效果，适用于电源滤波与共模抑制前段（作为差模或单端电感）。
- 额定电流 500 mA 能满足多数轻负载或中等电流的去耦需求；需注意 Isat 较低，在大电流瞬变场合易出现电感值下降。
四、典型应用场景
- DC–DC 转换器的输入/输出滤波与能量储存（尤其在低功率应用）
- 电源去耦与 EMI 抑制（配合电容构成 LC 滤波）
- 模拟与射频前端的低频滤波（在 SRF 以上行为需注意）
- 移动设备、可穿戴与消费电子中对体积与成本敏感的方案
五、选型与使用建议
- 若电路中存在较大直流偏置或脉冲电流，应关注饱和电流 Isat（180 mA），超过该值电感会显著下降，建议按实际峰值和占空比计算有效电流余量。
- 自谐频率约 2 MHz，器件在该频率附近会出现寄生电容影响，应避免将工作频率设在 SRF 附近或更高频段。
- DCR 会影响功耗与温升，设计时应将功率损耗（I^2·DCR）纳入热设计考虑。
- 对于要求更高精度或更低 DCR 的场合，可考虑更大封装或不同材料的替代产品。
六、封装与焊接注意
0805 贴片封装支持常规回流焊工艺，焊接温度曲线应符合推荐回流规范以避免热应力导致性能退化。装配时注意避免强烈弯折或应力集中，焊盘设计应兼顾可焊性与热散逸。
七、总结
MLZ2012M4R7WT000 为一款面向中低频滤波与去耦的 0805 叠层铁氧体电感，具有体积小、成本低、适配性强的优点。适合在对体积和成本敏感、工作电流不超过其饱和限制的电子产品中使用。选型时需重点评估实际电流、温升与工作频率，确保器件在合适的工作区间内稳定发挥性能。
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