Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TLP185(-TPL,SE(T TLP185
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TOSHIBA TLP185(GB-TPL, SE(T
- Type
- TOSHIBA
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- TLP185(GB-TPL,SE(T
- Electronic Component
- 1
- Package
- SOP-4-2.54mm
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.287g
- Electronic Component
- 1
- Electronic Component
- 3us
- Electronic Component
- BM0000284618
- Operating Temperature
- 55℃~+110℃
- Load Voltage
- 80V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP185 产品概述
一、基本信息
TLP185 是东芝（TOSHIBA）推出的一款高性能 DC 光电耦合器，采用SOP-4封装，具有单通道的配置，广泛应用于工业自动化、测量仪器和通信设备等领域。其核心特征包括较高的隔离电压、宽广的输出电压范围和强大的抗干扰能力，确保设备在复杂环境下的稳定运行。
二、主要特点
输入类型：TLP185 为直流（DC）输入类型，这意味着其适用于需要稳定直流电信号的应用。在许多数字和模拟电路中，不同的直流电平可以转化为逻辑信号，非常适合数字电路的需要。
通道数目：该器件为单通道设计，简化了电路设计和布线复杂度，适合需要单一信号传输的应用。
隔离电压：值得一提的是，TLP185 拥有高达 3750 Vrms 的隔离电压，这一特性使得器件在高噪声环境中仍能保持良好的信号完整性，并有效保护后级电路免受高电压的影响。
输出电压和电流：该光耦的最大输出电压为 80V，输出电流可达 50mA。这种性能使其能够满足大多数中小功率设备的需求，同时也可以在更高电压应用的场合中实现高效率的信号传输。
晶体管输出：使用晶体管作为输出元素，使得 TLP185 在开关频率上具有良好的响应速度，对于快速信号的传送非常合适。此外，其输出特性可以提供良好的线性性能，适合模拟信号的应用。
包装和安装：采SOP-4封装设计，具备良好的耐热性和小尺寸，适合于密集度高的电路板上使用。其安装简单，适应PCB表面贴装（SMD）工艺，进一步提高了生产效率。
三、应用场景
TLP185 光电耦合器因其优异的技术参数，已被广泛应用于多种领域：
工业自动化：在PLC（可编程逻辑控制器）及传感器应用中，TLP185 可以用于通信信号的隔离，保护控制系统不受高电压和噪声影响。
数据采集系统：在要求高隔离、高信号完整性的应用中，如数据采集和测量设备，TLP185 能确保获取的信号准确可靠。
电力监控：在电源监控和仪表设备中，TLP185 提供良好的信号隔离和转换能力，确保监测结果的真实性。
通信设备：在各种通信设备中，TLP185 提供必要的信号隔离，保护敏感电路不受干扰，提高了系统的整体稳定性和抗干扰能力。
四、总结
总的来说，TLP185 光电耦合器以其高隔离电压、素质通道和晶体管输出的特性，满足了多种应用的需求。同时其 compact SOP-4 封装设计，使得它易于在紧凑型电路中使用。无论是在工业自动化、通信，还是在数据采集领域，TLP185 都展示了其广泛的适配性与出色的性能表现，是设计工程师们在选择光耦合器时一个理想的选项。通过使用 TLP185，设计师们能够有效地提高电路的性能和可靠性，确保最终产品的质量与效率。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
