WMSIC Electronic Components

TAIYO YUDEN JDK105CBJ226MV-F JDK105CBJ226MV

ModelJDK105CBJ226MV-F
Package0402
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
TAIYO YUDEN JDK105CBJ226MV-F
Type
TAIYO YUDEN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
JDK105CBJ226MV-F
Electronic Component
1
Electronic Component
22uF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.011g
Electronic Component
1
Electronic Component
BM0257253431
Electronic Component
X5R
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

JDK105CBJ226MV-F 产品概述

一、产品简介

JDK105CBJ226MV-F 为 TAIYO YUDEN(太诱)出品的片式多层陶瓷电容(MLCC),标称容量 22 μF,温度特性为 X5R,封装尺寸为 0402(1005 公制)。该系列面向对空间和体积要求严格的便携式与高密度电路板设计,提供较高的容量密度与良好的频率响应,适合作为去耦与旁路电容使用。

二、主要特性

  • 标称容量:22 μF
  • 温度特性:X5R(工作温度范围约 -55°C 至 +85°C,典型温度依赖性±15% 级别)
  • 封装:0402(尺寸极小,适合高密度贴片装配)
  • 容差:代号“J”通常表示 ±5%(请以具体产品数据表为准)
  • 电气特征:类二介质低等效串联电阻(ESR)与低等效串联电感(ESL),适合高频去耦;但在直流偏置下容量会显著下降(DC-bias 效应需关注)。

三、典型应用场景

  • 移动终端、可穿戴设备、IoT 节点等空间受限的消费电子产品电源旁路与去耦;
  • PCB 上的局部电源储能与瞬态电流供应,减小电源噪声;
  • 与更小电容并联,用于改善不同频段的电源滤波效果;
  • 不建议用于对容量精度、长期稳定性或超高温环境有严格要求的时基或滤波电路。

四、设计与选型建议

  • DC-bias 考量:X5R 在较高偏压下容量会下降,22 μF 在 0402 封装下尤为明显。设计时应根据实际工作电压查看数据表给出的容量-电压曲线,并适当预留裕量。
  • 温度与老化:X5R 随温度变化及随时间存在容量漂移,应根据工作环境和寿命要求做好裕量设计。
  • 并联策略:为兼顾低频与高频性能,可将该电容与若干小容值低 ESR 的 MLCC 并联使用,从而平衡瞬态响应与稳定性。
  • 替代方案:若需更宽温度范围或更低老化,考虑 X7R 或 C0G/NP0(视容量可得性)或使用更大封装以减小 DC-bias 影响。

五、封装与焊接注意事项

  • 0402 封装体积小,贴装与回流焊过程需严格按照制造商的回流温度曲线(如 JEDEC/J-STD-020)进行,以避免热应力或机械破裂;
  • 运输、贴装时避免过大挤压、弯曲或冲击,陶瓷电容对机械应力敏感;
  • 在高速或高振动应用中,建议在 PCB 布局时减小应力集中并采用合适的固定措施。

总结:JDK105CBJ226MV-F 在占板面积极小的条件下提供较大电容量,适合移动与高密度电子产品的去耦和储能应用。但应重点关注 X5R 的 DC-bias、温度漂移与老化特性,并在选型与布局阶段采取相应的补偿与验证措施。若需完整电气与可靠性参数,请参照 TAIYO YUDEN 官方数据手册。

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