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TAIYO YUDEN TMK063ABJ104KP-F TMK063ABJ104KP
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TAIYO YUDEN TMK063ABJ104KP-F
- Type
- TAIYO YUDEN
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TAIYO YUDEN
- Electronic Component
- TMK063ABJ104KP-F
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.009g
- Electronic Component
- 1
- Electronic Component
- BM0257253362
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TMK063ABJ104KP-F 产品概述
一、产品简介
TMK063ABJ104KP-F 是太陽誘電（TAIYO YUDEN）生产的一款高可靠性多层陶瓷贴片电容（MLCC），标称电容量为100nF（0.1µF），容差±10%（K），额定电压25V，温度特性为 X5R。该型号采用超小封装 0201，专为对尺寸、频率响应与旁路性能有严格要求的便携与高密度电路设计而开发。
二、主要参数
- 容值：100nF（0.1µF）
- 容差：±10%（K）
- 额定电压：25V DC
- 介质：X5R（工作温度范围 -55℃ ～ +85℃，温度变化范围内电容变化 ≤ ±15%）
- 封装：0201（约 0.6 mm × 0.3 mm，超小型封装）
- 用途：去耦、旁路、高频滤波、阻抗匹配等
三、关键特性
- 体积小、容值密度高，适合高密度 PCB 布局。
- X5R 介质在常见温度范围内提供较稳定的电容值与较高的介电常数，适合电源去耦与一般用途滤波。
- 低 ESR / 低 ESL 特性，适合高频瞬态抑制与脉冲去耦。
- 封装为 0201，可用于空间受限的移动设备与可穿戴产品。
四、典型应用
- MCU、SoC 电源旁路与去耦
- 电源管理 IC 输出滤波与稳压模块
- 手机、可穿戴设备、物联网终端等便携式电子产品
- 高频信号链的去耦与旁路、EMI 抑制电路
五、设计与选型建议
- X5R 为介质电容随温度变化可达 ±15%，在需高稳定性的模拟电路或计时电路应考虑用 C0G/NP0 等温度特性更好的类型。
- MLCC 在施加直流偏压时会出现电容降低（DC bias 特性），设计时应参考太陽誘電官方曲线并留有裕量，尤其在接近额定电压工作时。
- 若需要更低等效串联电阻或更大电流承载能力，可并联多个相同或不同容值的 MLCC 以优化性能。
六、封装与贴装注意事项
- 0201 为超小型封装，对点胶、贴装精度与回流工艺要求高，建议使用精密贴片设备与严格的印刷锡膏工艺控制。
- 遵循制造商推荐的回流曲线（无铅回流）以避免热应力造成裂纹。
- PCB 设计时避免在器件两端产生过大的机械应力，焊盘设计与 SMT 工艺需减少板弯曲导致的破裂风险。
七、可靠性与存储
- MLCC 对潮湿与机械应力敏感，建议潮湿敏感等级（MSL）管理与干燥箱保存（如需回流前烘烤按供应商建议处理）。
- 常温常压存储，避免长时间暴露于高温高湿环境；运输与装配过程中注意防静电与防振保护。
八、采购与替代
- 订购时请确认完整料号与包装形式（卷带/Reel 等）并参考太陽誘電最新数据表获取详细电气与机械参数。
- 若需更高温稳定性可考虑 C0G/NP0 系列，若需更大电压或不同封装可选用相近容值与不同尺寸的 TMK 系列型号。
如需本型号的详细电气曲线（DC bias、频率特性、温度特性）、回流焊曲线或 PCB 焊盘建议文件，我可以根据太陽誘電官方资料为您整理关键数据与设计模板。
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