WMSIC Electronic Components

TAIYO YUDEN LMK063BC6474KPLF

ModelLMK063BC6474KPLF
Package0201
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TAIYO YUDEN LMK063BC6474KPLF
Type
TAIYO YUDEN
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
LMK063BC6474KPLF
Electronic Component
1
Electronic Component
±10%
Package
0201
Electronic Component
SMPS
Capacitor
.47µF
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.009g
Electronic Component
1
Electronic Component
BM0264757349
Type
Surface Mount, MLCC
Operating Temperature
55°C ~ 105°C
Electronic Component
X6S
Electronic Component
0.024" x 0.012" (0.60mm x 0.30mm)

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMK063BC6474KPLF 产品概述

一、产品简介

LMK063BC6474KPLF 是 TAIYO YUDEN(太陽誘電)的一款超小型多层陶瓷电容(MLCC),规格为 0.47µF ±10%,额定电压 10V,温度特性 X6S,封装为 0201(0.024" × 0.012" / 0.60mm × 0.30mm),最大厚度 0.015"(0.39mm)。工作温度范围为 -55°C 到 +105°C,适用于对体积和布局密度要求极高的移动与电源管理应用,尤其常见于 SMPS 滤波与去耦场合。

二、主要性能特点

  • 容量:0.47µF,公差 ±10%,适合中高容值去耦与滤波。
  • 额定电压:10V,适用于大多数低压电源轨(如 1.8V / 3.3V / 5V)附近去耦。
  • 温度特性:X6S(-55°C ~ +105°C),在该温度范围内保持稳定工作。
  • 超小体积:0201(0.6 × 0.3 mm),便于高密度 PCB 设计与节省空间。
  • 表面贴装(SMD/MLCC),适配自动化贴装与回流焊工艺。

三、应用场景与推荐用法

  • SMPS 输出/输入滤波与高频去耦:靠近开关管与控制芯片放置以抑制开关噪声。
  • 移动设备与便携终端:在受限空间内提供高容值去耦。
  • 串并联组合以提高有效电容或降低 ESR/ESL:可根据实际滤波需求并联多个器件。

推荐做法:

  • 将电容尽量靠近电源管脚布局,缩短走线。
  • 对于对低直流偏置要求严格的场合,务必参考厂商 DC bias 特性图,必要时并联更大电压等级或多只电容以补偿偏置损失。
  • 遵循制造商回流焊温度曲线与湿度敏感等级(MSL)要求。

四、设计与可靠性注意事项

  • DC bias 与温度依赖:X6S 类陶瓷在偏压与高温情况下会出现容量下降,设计时需留有裕量或查询详细特性曲线。
  • 机械应力敏感:0201 尺寸极小且厚度薄,贴装与回流后板弯曲或搬运可能引起裂纹。焊盘设计与回流工艺需优化,避免强烈热冲击与过度弯曲。
  • 焊盘布局:建议遵循 Taiyo Yuden 建议的焊盘尺寸与焊膏量,以保证焊接可靠性与电气性能。

五、采购与替代方案建议

  • 该型号常以卷带(reel)形式供货,适配自动贴片生产线。下单时请确认供货包装与批次信息。
  • 若电路对 DC bias 或温度稳定性有更高要求,可考虑使用温度系数更稳定的介质(如 NPO/C0G)或在电压裕度允许时提高额定电压与并联策略。
  • 选型时务必获取并查阅官方 datasheet,确认 DC bias 曲线、等效串联电阻(ESR)、等效串联电感(ESL)、寿命与可靠性测试项。

总结:LMK063BC6474KPLF 提供在极小体积下较高的电容值,适合高密度电源滤波与去耦应用。设计时重点关注 DC bias、回流工艺与机械应力管控,按厂方资料进行电气与可靠性验证以确保长期稳定运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.