WMSIC Electronic Components

TAIYO YUDEN LMK105BJ105KV-F LMK105BJ105KV

ModelLMK105BJ105KV-F
Package0402
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TAIYO YUDEN LMK105BJ105KV-F
Type
TAIYO YUDEN
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
LMK105BJ105KV-F
Electronic Component
1
Electronic Component
1uF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.011g
Electronic Component
1
Electronic Component
BM0263493410
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:LMK105BJ105KV-F

一、基本信息

LMK105BJ105KV-F 是一种高质量、表面贴装的多层陶瓷电容器(MLCC),由知名电子元件制造商 TAIYO YUDEN(太诱)生产。该元器件的关键规格包括电容值1µF、电压额定值10V、容差范围±10%、以及温度系数X5R。这款电容器特别适用于开关电源(SMPS)过滤器,广泛应用于各种电子设备中,提升其电路的稳定性和性能。

二、技术参数

  1. 电容值:1µF,能够有效地平衡电荷和电压,适合储能和过滤用途。
  2. 容差:±10%,保证了在不同工作环境下电容的可靠性和稳定性。
  3. 额定电压:10V,此参数保证电容器在最大负载下的安全运行,适应中低电压的应用场合。
  4. 温度系数:X5R,这种陶瓷电容具有良好的温度稳定性,能够在-55°C 到 85°C 的广泛温度范围内保持电容值的稳定。
  5. 工作温度:该电容器适应的工作温度从-55°C到85°C,确保其在极端环境下的稳定性。
  6. 安装类型:表面贴装(SMD),提供了更好的电气性能和紧凑的设计,适合现代高密度电路板。
  7. 封装/外壳:0402(1005公制),其小巧的尺寸(1mm x 0.5mm)非常适合空间受限的电子应用。
  8. 厚度:最大厚度为0.55mm,高度较低,有助于设计超薄的电子设备。

三、主要特点

  1. 高频响应:X5R温度系数使其具备卓越的高频性能,适合用于高频信号处理电路及开关电源系统中。
  2. 低ESR:多层陶瓷电容器的结构确保了低等效串联电阻(ESR),在高频应用中可以显著降低功率损耗。
  3. 高可靠性:TAIYO YUDEN的生产工艺确保了产品的高可靠性,能够承受长时间的使用和各种工作环境的考验。

四、应用领域

LMK105BJ105KV-F 主要应用于以下领域:

  1. 开关电源(SMPS):在开关电源电路中起到储能和过滤电压波动的作用,提升电源质量并降低干扰。
  2. 消费电子:在智能手机、平板电脑、笔记本电脑等消费电子产品中,提供稳定的工作电源和信号处理。
  3. 通信设备:在基站、路由器、和其他无线通信设备中,用于电源管理和信号完整性保护。
  4. 汽车电子:在汽车控制模块和导航系统等电子设备中,发挥电源滤波和快充功能。

五、总结

LMK105BJ105KV-F 是一款集高性能、高可靠性和小型化于一体的多层陶瓷电容器,充分满足了现代电子设备对电源和信号稳定性的要求。TAIYO YUDEN(太诱)凭借其卓越的制造工艺,确保了此款电容器在多种应用场合中的出色表现,是开发和设计智能、紧凑型电子产品的理想选择。通过使用该电容器,设计工程师能够显著提升电路的信号完整性和功率效率,从而满足当今市场对高性能电子设备的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.